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7SB3126AMX1TCG

Onsemi

7SB3126AMX1TCG by Onsemi

7SB3126AMX1TCG by Onsemi is a Bus Driver & Transceiver with 6 terminals, 2 ports, and 0.25 ns propagation delay. It operates b/w -55 to 125 °C and has a supply voltage range of 4-5 V. Ideal for military-grade applications requiring small outline and thin profile packages.

Median Price

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Lifecycle Status

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2

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< 1k

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QUARKTWIN TECHNOLOGY LTD

USA . 19,842 parts In-Stock

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TANS Electronics

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Microchip USA

USA . 5,664 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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Corphita

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Corohmni

South Africa . 289 parts In-Stock

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UHIMA Technologies

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Problanco Electronics

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Overview

Enhance your electronic designs with the reliable 7SB3126AMX1TCG bus driver & transceiver from Onsemi. As a trusted manufacturer in the industry, Onsemi delivers high-quality components that are essential for various applications. This surface-mount device offers seamless integration into your projects with its small outline and very thin profile package style. With a nominal supply voltage of 4.5V and excellent thermal performance, this product ensures optimal functionality in extreme temperatures. Experience the value and benefits of this innovative solution, providing inverted output polarity, low propagation delay, and military-grade temperature resilience. Elevate your designs with the 7SB3126AMX1TCG and unlock endless possibilities in electronics engineering.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on circuit boards, saving space and reducing assembly time.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient and reliable operation of the bus driver and transceivers.

Propagation Delay (tpd): 0.25 ns

Provides fast signal transmission, ensuring quick and accurate data transfer.

Maximum Operating Temperature: 125 °C

Ability to function in high temperature environments, making it suitable for a variety of applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Durable finish that enhances conductivity and resistance to corrosion, ensuring long-lasting performance.

Temperature Grade: MILITARY

Meets rigorous military standards for reliability and performance in demanding conditions.

Technical Specifications

Bus Driver & Transceivers 7SB3126AMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.45 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

7SB3126AMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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