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7SB3125CMX1TCG

Onsemi

7SB3125CMX1TCG by Onsemi

7SB3125CMX1TCG by Onsemi is a Bus Driver & Transceiver with 6 terminals, 2 ports, and a propagation delay of 0.25 ns. It operates b/w -55 to 125 °C and has a supply voltage range of 4-5.5 V. Ideal for military applications due to its small outline package style and nickel palladium gold terminal finish.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Digiode

USA . 360 parts In-Stock

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360

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Vyrian

USA . 199 parts In-Stock

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199

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Distributors (Availability)

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Native Components

USA . 188 parts In-Stock

1+ parts

$17.750

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188

$17.750

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Northwest PG Solutions

USA . 1,842 parts In-Stock

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$19.525

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$17.572

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$19.525

$17.572

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Problanco Electronics

Mexico . 3,625 parts In-Stock

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3,625

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SupplyDigital Components

Austria . 3,362 parts In-Stock

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3,362

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Kulean Microsystems

USA . 3,157 parts In-Stock

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Corphita

USA . 2,336 parts In-Stock

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2,336

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UHIMA Technologies

Türkiye . 909 parts In-Stock

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TANS Electronics

Latvia . 656 parts In-Stock

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Microchip USA

USA . 365 parts In-Stock

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365

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Corohmni

South Africa . 321 parts In-Stock

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321

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Overview

Discover the unbeatable quality of the 7SB3125CMX1TCG by Onsemi, a top-tier manufacturer renowned for cutting-edge technology and innovation. This bus driver & transceiver is a game-changer in its category, offering unmatched reliability and performance. With a nominal supply voltage of 4.5V and a wide operating temperature range, this product is ideal for a variety of applications. Experience the value and benefits this surface mount device brings to your projects with its unique features and exceptional design. Elevate your electronics with the 7SB3125CMX1TCG and see the difference for yourself!

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for easy and efficient integration onto circuit boards, saving space and potentially reducing production costs.

Package Shape: SQUARE

The square package shape provides stability and easy alignment during assembly, contributing to overall reliability of the product.

Nominal Supply Voltage / Vsup (V): 4.5

The 4.5V nominal supply voltage is within a common range, making it compatible with many existing systems and power sources.

Propagation Delay (tpd): 0.25 ns

The low propagation delay of 0.25 ns ensures fast and efficient signal transmission, crucial for high-performance applications.

Temperature Grade: MILITARY

Being military grade ensures that the product meets stringent quality and reliability standards, making it suitable for mission-critical applications.

Technical Specifications

Bus Driver & Transceivers 7SB3125CMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

S-XDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,14

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Sub-Category:

Bus Driver/Transceiver

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

7SB3125CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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