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7SB385BMX1TCG

Onsemi

7SB385BMX1TCG by Onsemi

The Onsemi 7SB385BMX1TCG is a surface mount bus driver with 6 terminals and a nominal voltage of 4.5V. Featuring a propagation delay of 0.25ns, it operates in temperatures ranging from -55 to 125 °C. Ideal for military applications requiring small outline and thin profile packages with inverted output polarity.

Median Price

$0.159

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$0.159

1k+ parts

$0.132

10k+ parts

$0.117

3,000

-

$0.159

$0.132

$0.117

Farnell

UK . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.113

3,000

-

-

-

$0.113

Verical

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.165

3,000

-

-

-

$0.165

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,006 parts In-Stock

1+ parts

$0.113

100+ parts

-

1k+ parts

-

10k+ parts

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1,006

$0.113

-

-

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Digiode

USA . 1,135 parts In-Stock

1+ parts

$0.124

100+ parts

-

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1,135

$0.124

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 290 parts In-Stock

1+ parts

$0.113

100+ parts

-

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290

$0.113

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Corphita

USA . 790 parts In-Stock

1+ parts

$0.117

100+ parts

-

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790

$0.117

-

-

-

Native Components

USA . 439 parts In-Stock

1+ parts

$1.770

100+ parts

-

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439

$1.770

-

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Northwest PG Solutions

USA . 2,165 parts In-Stock

1+ parts

$1.947

100+ parts

-

1k+ parts

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10k+ parts

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2,165

$1.947

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SupplyDigital Components

Austria . 6,715 parts In-Stock

1+ parts

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6,715

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Problanco Electronics

Mexico . 5,554 parts In-Stock

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5,554

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TANS Electronics

Latvia . 3,051 parts In-Stock

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3,051

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Continental Prestige Electronics

USA . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.117

10k+ parts

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3,000

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$0.117

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Kulean Microsystems

USA . 1,544 parts In-Stock

1+ parts

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1,544

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UHIMA Technologies

Türkiye . 877 parts In-Stock

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877

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Microchip USA

USA . 387 parts In-Stock

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387

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Overview

Discover the innovative 7SB385BMX1TCG by Onsemi, a top-tier manufacturer in the Bus Driver & Transceivers category. This surface mount device offers unparalleled quality and reliability, making it ideal for a wide range of applications. With a nominal supply voltage of 4.5V, dual terminal position, and military-grade temperature grade, this product ensures optimal performance in any environment. Experience the value and benefits of this cutting-edge technology, from its small outline package style to its fast propagation delay of 0.25 ns. Upgrade your systems with the 7SB385BMX1TCG and unleash the power of precision engineering at your fingertips.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable makes it easy to integrate into compact designs and saves space on the PCB.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of board space and easy placement on the PCB.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage ensures stable and reliable operation of the bus driver & transceivers.

Propagation Delay (tpd): 0.25 ns

Low propagation delay ensures fast signal transmission, making it suitable for high-speed applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for use in a wide range of environments and applications.

Minimum Operating Temperature: -55 °C

Wide range of minimum operating temperature makes it suitable for both cold and hot environments.

No. of Ports: 2

Having 2 ports allows for versatile connectivity options and use in dual-channel communication systems.

Length: 1.2 mm

Compact length facilitates easy placement on the PCB and saves space in the overall design.

Output Polarity: INVERTED

Inverted output polarity offers flexibility in signal processing and compatibility with different system configurations.

Technical Specifications

Bus Driver & Transceivers 7SB385BMX1TCG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-XDSO-N6

JESD-609 Code:

e4

Length:

1.2 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

.4 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

7SB385BMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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