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74ALVC16373DTR

Onsemi

74ALVC16373DTR by Onsemi

74ALVC16373DTR by Onsemi is a bus driver with 8 bits, 3.6 ns propagation delay, and 24 Amp max I (ol). It operates at a supply voltage of 3.3V and is ideal for industrial applications requiring CMOS technology in a small outline package.

Median Price

$0.292

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

$0.304

1k+ parts

$0.252

10k+ parts

$0.225

2,500

-

$0.304

$0.252

$0.225

Verical

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.281

2,500

-

-

-

$0.281

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,583 parts In-Stock

1+ parts

$0.237

100+ parts

-

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10k+ parts

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1,583

$0.237

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-

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Vyrian

USA . 3,515 parts In-Stock

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3,515

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 461 parts In-Stock

1+ parts

$0.213

100+ parts

-

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461

$0.213

-

-

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Corphita

USA . 1,170 parts In-Stock

1+ parts

$0.224

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-

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1,170

$0.224

-

-

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Native Components

USA . 155 parts In-Stock

1+ parts

$5.010

100+ parts

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155

$5.010

-

-

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AZTECH Wire

Italy . 860 parts In-Stock

1+ parts

$14.580

100+ parts

-

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860

$14.580

-

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Problanco Electronics

Mexico . 5,790 parts In-Stock

1+ parts

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5,790

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TANS Electronics

Latvia . 4,776 parts In-Stock

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4,776

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Kulean Microsystems

USA . 4,056 parts In-Stock

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4,056

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Continental Prestige Electronics

USA . 2,500 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.213

10k+ parts

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2,500

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-

$0.213

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SupplyDigital Components

Austria . 1,480 parts In-Stock

1+ parts

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1,480

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Robosynatics

Brazil . 1,480 parts In-Stock

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1,480

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Lucentia Tech

USA . 1,480 parts In-Stock

1+ parts

-

100+ parts

$32.493

1k+ parts

$30.089

10k+ parts

$30.089

1,480

-

$32.493

$30.089

$30.089

Northwest PG Solutions

USA . 1,349 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$4.910

10k+ parts

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1,349

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$4.910

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Microchip USA

USA . 173 parts In-Stock

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173

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UHIMA Technologies

Türkiye . 154 parts In-Stock

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154

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Overview

Enhance your electronic systems with the reliable 74ALVC16373DTR bus driver and transceiver from Onsemi. Crafted with precision using top-quality materials, this versatile component offers fast propagation delays and low power consumption, making it ideal for a wide range of applications. Whether you're designing consumer electronics or industrial equipment, this product's exceptional performance and durable construction will ensure seamless operation. Upgrade your projects today with the Onsemi 74ALVC16373DTR and experience superior quality and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, providing a reliable housing for the driver and transceiver.

Propagation Delay At Nominal Supply: 3.6 ns

Low propagation delay ensures fast and efficient signal transmission.

Surface Mount: YES

Allows for easy and efficient assembly onto circuit boards.

No. of Functions: 2

This product performs multiple functions, offering versatility in use.

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into circuit designs.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage ensures consistent performance of the driver and transceiver.

Load Capacitance (CL): 30 pF

Optimal load capacitance for efficient signal transmission.

Power Supplies (V): 3.3

Compatible with standard power supplies, making it easy to integrate into existing systems.

No. of Terminals: 48

Sufficient terminals for connecting to various components in a circuit.

Maximum I (ol): 24 Amp

High output current capability for driving bus lines effectively.

Propagation Delay (tpd): 7.8 ns

Low propagation delay ensures fast signal transmission for time-sensitive applications.

Maximum Operating Temperature: 85 °C

Wide temperature range allows for operation in various environmental conditions.

Output Characteristics: 3-STATE

3-state output allows for flexible control of the driver and transceiver output signals.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in extreme cold conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in connection options.

Width: 6.1 mm

Compact width for space-saving integration into circuit designs.

Output Polarity: TRUE

True output polarity ensures correct signal representation.

Minimum Supply Voltage (Vsup): 1.65 V

Low minimum supply voltage requirement for efficient power consumption.

Peak Reflow Temperature °C: 235

High peak reflow temperature allows for reliable soldering during assembly.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and efficient soldering during assembly.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact layout and efficient connection to other components.

Maximum Supply Voltage (Vsup): 3.6 V

High maximum supply voltage allows for operation in systems with higher voltage requirements.

Technical Specifications

Bus Driver & Transceivers 74ALVC16373DTR attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

ALVC/VCX/A

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e0

Length:

12.5 mm

Load Capacitance (CL):

30 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

235

Power Supplies (V):

3.3

Propagation Delay At Nominal Supply:

3.6 ns

Propagation Delay (tpd):

7.8 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74ALVC16373DTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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