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TDF8546JS/N2,512

NXP Semiconductors

TDF8546JS/N2,512 by NXP Semiconductors

TDF8546JS/N2,512 from NXP Semiconductors is a robust audio amplifier designed for industrial applications. It operates at 14.4V with a max supply current of 350mA and withstands temperatures from -40 °C to 105 °C. Its zig-zag terminal design ensures reliable performance in various environments.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,720 parts In-Stock

1+ parts

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7,720

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Digiode

USA . 4,710 parts In-Stock

1+ parts

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4,710

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Anansix

USA . 1,388 parts In-Stock

1+ parts

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1,388

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 204 parts In-Stock

1+ parts

$12.590

100+ parts

-

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204

$12.590

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One Stop Electronics

USA . 898 parts In-Stock

1+ parts

$12.800

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898

$12.800

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QUARKTWIN TECHNOLOGY LTD

USA . 18,565 parts In-Stock

1+ parts

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18,565

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Corphita

USA . 3,266 parts In-Stock

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3,266

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UNI Independent Distributors

Spain . 2,823 parts In-Stock

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2,823

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Microchip USA

USA . 1,536 parts In-Stock

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1,536

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Overview

Elevate your audio experience with the TDF8546JS/N2,512 from NXP Semiconductors, where quality meets innovation. Renowned for robust performance and reliability, this amplifier is designed to deliver superior sound clarity across various applications, from automotive systems to home entertainment. With its durable design and precise engineering, you can trust it to enhance audio output while ensuring energy efficiency. Choose NXP for exceptional value and unmatched benefits in your audio projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy in the package body provides durability and protection against environmental factors, making the amplifier suitable for various applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient layout and integration into compact designs, benefiting space-constrained applications.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures optimized performance for audio signals, delivering high-quality sound output.

Power Supplies (V): 14.4

The 14.4V power supply requirement is well-suited for automotive and industrial applications where such voltage levels are common.

No. of Terminals: 27

With 27 terminals, this amplifier offers multiple connectivity options, enhancing versatility for various configurations and setups.

Package Style (Meter): IN-LINE

The in-line package style is advantageous for mounting in standard equipment layouts, facilitating easier assembly and integration.

Maximum Operating Temperature: 105 °C

The amplifier can operate safely at temperatures up to 105 °C, making it reliable in high-temperature environments.

Minimum Operating Temperature: -40 °C

Its ability to function at -40 °C allows for use in extreme cold conditions, thereby broadening its potential applications.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning enhances printed circuit board (PCB) layout flexibility, allowing for tighter spacing and improved design efficiency.

Peak Reflow Temperature °C: 225

A peak reflow temperature of 225 °C indicates compatibility with standard soldering processes, ensuring reliable assembly.

Temperature Grade: INDUSTRIAL

Rated for industrial use, this amp is built to withstand demanding environments, positioning it as a trustworthy choice for professional applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and reliability, essential for applications requiring strong connections.

Maximum Supply Current: 350 mA

A maximum supply current of 350 mA supports powerful audio output, ensuring the amplifier can handle demanding audio tasks effectively.

Terminal Pitch: 1 mm

The 1 mm terminal pitch allows for fine PCB design, facilitating compact and complex circuit layouts while ensuring effective signal integrity.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates that this product can withstand a moderate level of moisture during handling, enhancing its reliability in various storage conditions.

Technical Specifications

Audio & Video Amplifiers TDF8546JS/N2,512 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T27

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

27

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP27H,.08,.7,40

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

225

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

350 mA

Surface Mount:

NO

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDF8546JS/N2,512 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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