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TDF8544TH/N2

NXP Semiconductors

TDF8544TH/N2 by NXP Semiconductors

TDF8544TH/N2 by NXP Semiconductors is a robust audio amplifier with a nominal output power of 51 W and operates within -40 °C to 105 °C. It features low harmonic distortion at 10% and comes in a compact rectangular package. Ideal for industrial audio applications, it supports surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,826 parts In-Stock

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2,826

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Anansix

USA . 2,005 parts In-Stock

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2,005

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Vyrian

USA . 1,863 parts In-Stock

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1,863

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One Stop Electronics

USA . 215 parts In-Stock

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$12.800

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215

$12.800

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A-Z Elektronik GmbH

Germany . 6,408 parts In-Stock

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6,408

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UNI Independent Distributors

Spain . 5,316 parts In-Stock

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Corphita

USA . 783 parts In-Stock

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783

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Perfect Parts

USA . 580 parts In-Stock

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580

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Overview

Elevate your audio experience with the TDF8544TH/N2 from NXP Semiconductors, a powerhouse in precision engineering. Crafted for top-notch performance, this audio amplifier excels in delivering rich sound quality while ensuring reliability across various applications—from automotive to home entertainment systems. With its robust design and advanced BCDMOS technology, you can trust in its durability and efficiency, bringing unmatched value and enjoyment to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures longevity and resistance to environmental factors, making the amplifier suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into modern circuit boards, saving space in audio/video devices.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient layout on PCBs, facilitating better space utilization in audio and video systems.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this product is specifically designed to enhance sound quality, making it ideal for audio applications.

Harmonic Distortion: 10 %

With a harmonic distortion rate of only 10%, this amplifier delivers clear and high-quality audio performance, ensuring a rich listening experience.

No. of Terminals: 36

A higher number of terminals allows for greater flexibility in circuit design and improves the connectivity options for various applications.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This package style is effective for heat dissipation, essential for maintaining performance in high-power audio applications.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliability and performance even under demanding conditions in industrial environments.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40 °C makes this amplifier suitable for outdoor and harsh climate applications.

Terminal Position: DUAL

Dual terminal positioning can provide better power distribution and allows for easier layout in tight spaces.

Nominal Output Power: 51 W

With a nominal output power of 51 W, this amplifier delivers sufficient power to support a wide range of audio devices, ensuring robust performance.

Maximum Seated Height: 3.5 mm

A low seated height of 3.5 mm allows for low-profile designs, making it suitable for applications where space is limited.

Width: 11 mm

The compact width of 11 mm makes it easy to fit into various audio applications without compromising performance.

Minimum Supply Voltage (Vsup): 6 V

A low minimum supply voltage of 6 V ensures compatibility with a variety of power supply designs, increasing versatility.

Length: 15.9 mm

The compact length of 15.9 mm supports space-saving designs, ideal for integrated electronic solutions.

Temperature Grade: INDUSTRIAL

Industrial temperature grade guarantees durability and performance in challenging environmental conditions, suitable for professional audio settings.

Technology: BCDMOS

Using BCDMOS technology, this amplifier achieves higher efficiency and performance, enacting superior sound quality.

Nominal Bandwidth: 0.022 kHz

A nominal bandwidth of 0.022 kHz indicates suitability for low-frequency applications, important in audio reproduction.

Terminal Form: GULL WING

The gull wing terminal form allows for easy soldering and reliable connections, improving overall product reliability.

Terminal Pitch: 0.65 mm

A terminal pitch of 0.65 mm is conducive to modern PCB designs, allowing for denser layouts without compromising performance.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18 V, the amplifier can operate with higher power levels, ideal for demanding audio applications.

Technical Specifications

Audio & Video Amplifiers TDF8544TH/N2 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

51 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

TDF8544TH/N2 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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