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TDF8541TH/N2

NXP Semiconductors

TDF8541TH/N2 by NXP Semiconductors

TDF8541TH/N2 by NXP Semiconductors is a versatile audio amplifier with 44 W output power, operating b/w -40 °C to 105 °C. It features a compact design with 36 terminals and supports up to 4 channels. Ideal for industrial audio applications, it ensures low harmonic distortion at 10%.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,704 parts In-Stock

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2,704

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Digiode

USA . 1,929 parts In-Stock

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Anansix

USA . 244 parts In-Stock

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244

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One Stop Electronics

USA . 508 parts In-Stock

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$12.800

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508

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Assy Fe

Spain . 11,500 parts In-Stock

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11,500

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Kepictronics

USA . 6,892 parts In-Stock

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Authorized Procurement Solutions

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5,500

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UNI Independent Distributors

Spain . 2,169 parts In-Stock

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Corphita

USA . 1,075 parts In-Stock

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Futuretech Components

Singapore . 1,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,000 parts In-Stock

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Overview

Experience superior sound quality and reliability with the TDF8541TH/N2 audio amplifier from NXP Semiconductors. Designed for high-performance applications, this compact powerhouse delivers robust output while ensuring minimal distortion. NXP's commitment to innovation and excellence means you can trust its durability across diverse environments, from automotive to consumer electronics. Elevate your audio experience with a solution that combines performance, efficiency, and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection against environmental factors, making this amplifier suitable for various applications.

Surface Mount: YES

Surface mounting allows for compact design and efficient use of space on PCB, making it ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape facilitates easy integration into existing designs and provides optimal thermal management.

General IC Type: AUDIO AMPLIFIER

Being specifically designed as an audio amplifier ensures high-quality sound performance and reliability.

Harmonic Distortion: 10 %

With a harmonic distortion rate of 10%, this product delivers clean audio reproduction, enhancing the listening experience.

No. of Terminals: 36

A higher number of terminals offers more connectivity options, making it versatile for various circuit configurations.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

This packaging style enhances heat dissipation and minimizes space while maintaining performance, crucial in compact applications.

Maximum Operating Temperature: 105 °C

The ability to operate at high temperatures ensures reliability in demanding environments, making it ideal for industrial use.

Minimum Operating Temperature: -40 °C

Withstand low temperatures, this amplifier is suitable for a wide range of weather conditions, ensuring consistent performance.

Terminal Position: DUAL

Dual terminal position enhances flexibility in layouts and simplifies the design process for engineers.

Nominal Output Power: 44 W

A nominal output power of 44W provides robust audio performance, suitable for a variety of audio applications.

Maximum Seated Height: 3.5 mm

This low seated height is advantageous for compact devices with space constraints.

Width: 11 mm

At just 11 mm wide, this amplifier can fit into tight spaces without sacrificing performance.

Minimum Supply Voltage (Vsup): 6 V

The 6V minimum supply voltage allows operation in low voltage applications, expanding its usability.

Length: 15.9 mm

The compact length enables easy integration into smaller electronic devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial use ensures reliability and performance in challenging environments.

No. of Channels: 4

Four channels offer enhanced audio capabilities and flexibility for multi-channel audio systems.

Technology: BCDMOS

Utilizing BCDMOS technology improves performance and reduces power consumption, making it eco-friendly.

Nominal Bandwidth: 0.022 kHz

A low nominal bandwidth is suitable for specific audio applications where lower frequency response is prioritized.

Terminal Form: GULL WING

Gull wing terminals provide robust mechanical connection and are easy to solder, improving reliability.

Terminal Pitch: 0.65 mm

The 0.65 mm terminal pitch allows for a dense layout, making it suitable for miniaturized designs.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18V, this amplifier supports high-performance audio applications.

Technical Specifications

Audio & Video Amplifiers TDF8541TH/N2 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G36

Length:

15.9 mm

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

44 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

TDF8541TH/N2 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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