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TDF8544TH/N2,518

NXP Semiconductors

TDF8544TH/N2,518 by NXP Semiconductors

TDF8544TH/N2,518 by NXP Semiconductors is a versatile audio amplifier featuring 4 functions and operates within -40 °C to 105 °C. It supports a supply voltage of 14.4V with a max current of 350mA. Ideal for industrial applications, it comes in a compact surface mount package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,735 parts In-Stock

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Anansix

USA . 674 parts In-Stock

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674

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Digiode

USA . 236 parts In-Stock

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236

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Distributors (Availability)

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One Stop Electronics

USA . 525 parts In-Stock

1+ parts

$9.800

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525

$9.800

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AZTECH Wire

Italy . 942 parts In-Stock

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$12.650

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942

$12.650

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Ampacity Inc.

Singapore . 231 parts In-Stock

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$20.800

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231

$20.800

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Component Stockers USA

USA . 536 parts In-Stock

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$99.990

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536

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 14,819 parts In-Stock

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14,819

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UNI Independent Distributors

Spain . 6,501 parts In-Stock

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Microchip USA

USA . 2,948 parts In-Stock

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2,948

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Corphita

USA . 1,248 parts In-Stock

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1,248

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Overview

Elevate your audio experience with the TDF8544TH/N2,518 from NXP Semiconductors, a leader in innovation and quality. This versatile audio amplifier is designed for superior performance, ensuring crystal-clear sound across various applications—from automotive to consumer electronics. With its robust design and temperature resilience, customers enjoy reliable operation under diverse conditions, making it the ideal choice for enhancing any audio project. Choose NXP for unmatched value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy offers durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient manufacturing processes, optimizing board space.

No. of Functions: 4

Having four functions enhances versatility, enabling the amplifier to handle multiple audio channels or configurations effectively.

Package Shape: RECTANGULAR

The rectangular package shape aids in consistent stacking and easier integration into circuits, improving layout flexibility.

General IC Type: AUDIO AMPLIFIER

As a dedicated audio amplifier IC, it is designed to provide high-quality sound amplification for audio applications.

Power Supplies (V): 14.4

A power supply voltage of 14.4V provides strong performance for driving speakers and enhancing audio output.

No. of Terminals: 36

With 36 terminals, this amplifier offers multiple connectivity options, allowing for complex audio configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

This compact package style contributes to lower overall system size, making it perfect for space-constrained applications.

Maximum Operating Temperature: 105 °C

A maximum operating temperature of 105 °C ensures reliable performance even in demanding environments.

Minimum Operating Temperature: -40 °C

Operating reliably from -40 °C makes this amplifier ideal for industrial applications and extreme environments.

Terminal Position: DUAL

Dual terminal positions improve ease of soldering and enhance layout options on PCBs, optimizing design efficiency.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, this amplifier ensures durability and reliability under harsh conditions.

Technology: BCDMOS

BCD technology allows for efficient performance, resulting in lower power consumption and improved thermal performance.

Terminal Form: GULL WING

Gull wing terminals ensure secure connections and ease of handling during assembly, enhancing product reliability.

Maximum Supply Current: 350 mA

A maximum supply current of 350 mA allows for sufficient power delivery, ensuring optimal performance in audio applications.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch offers compatibility with standard PCBs, simplifying integration into existing designs.

Technical Specifications

Audio & Video Amplifiers TDF8544TH/N2,518 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PDSO-G36

No. of Functions:

4

No. of Terminals:

36

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP36,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

350 mA

Surface Mount:

YES

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

TDF8544TH/N2,518 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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