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TDF8541JS/N2,512

NXP Semiconductors

TDF8541JS/N2,512 by NXP Semiconductors

TDF8541JS/N2,512 from NXP Semiconductors is a versatile audio amplifier featuring 4 functions and operates b/w -40 °C to 105 °C. It supports a supply voltage of 14.4V with a max current of 350mA. Ideal for industrial audio applications, it comes in an in-line package with zig-zag terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,733 parts In-Stock

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3,733

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Anansix

USA . 2,802 parts In-Stock

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2,802

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Vyrian

USA . 2,098 parts In-Stock

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2,098

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Distributors (Availability)

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Microchip USA

USA . 440 parts In-Stock

1+ parts

$10.388

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440

$10.388

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AZTECH Wire

Italy . 1,213 parts In-Stock

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$11.460

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1,213

$11.460

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Ampacity Inc.

Singapore . 384 parts In-Stock

1+ parts

$14.800

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384

$14.800

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One Stop Electronics

USA . 862 parts In-Stock

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$21.800

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862

$21.800

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Corphita

USA . 1,104 parts In-Stock

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1,104

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UNI Independent Distributors

Spain . 1,029 parts In-Stock

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1,029

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Overview

Elevate your audio experience with the TDF8541JS/N2,512 from NXP Semiconductors, a trusted leader in innovation. This versatile audio amplifier promises unparalleled sound quality and reliability, making it perfect for diverse applications—from automotive systems to home theaters. With its robust design and industrial-grade temperature resilience, you can trust it to perform seamlessly in any environment. Choose NXP for unmatched value and performance that truly resonates!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures longevity and resistance to environmental factors, making this amplifier suitable for various applications.

No. of Functions: 4

With four functions, this audio amplifier offers versatility, allowing it to meet diverse audio needs in a single unit.

Package Shape: RECTANGULAR

The rectangular shape optimizes space in installations, making it easier to fit into different setups without wasting valuable room.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it is designed specifically for high-quality sound performance, making it ideal for audio applications.

Power Supplies (V): 14.4

Operating efficiently at 14.4V allows for compatibility with various audio systems while providing reliable performance.

No. of Terminals: 27

With 27 terminals, the amplifier offers ample connectivity options, ensuring flexibility in design and enhanced integration capabilities.

Package Style (Meter): IN-LINE

The in-line package style simplifies the assembly process and contributes to a streamlined design in audio applications.

Maximum Operating Temperature: 105 °C

The ability to operate at temperatures up to 105 °C ensures reliability in demanding environments, making it suitable for industrial settings.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this amplifier is perfect for extreme condition applications, ensuring consistent performance in all climates.

Terminal Position: ZIG-ZAG

The zig-zag terminal positioning can enhance space efficiency in PCB layouts, facilitating easier integration into various designs.

Temperature Grade: INDUSTRIAL

Rated for industrial temperature grades, this amplifier is built to withstand harsh environments while maintaining peak performance.

Technology: BCDMOS

Utilizing BCDMOS technology contributes to higher efficiency and lower distortion, providing superior sound quality for audio applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form enhances the durability and reliability of connections, making it a preferred choice for professional installations.

Maximum Supply Current: 350 mA

With a maximum supply current of 350 mA, this amplifier strikes a balance between performance and power efficiency, suitable for extended use.

Terminal Pitch: 1 mm

The 1 mm terminal pitch facilitates compact designs, allowing for more components in a smaller area, ideal for modern audio equipment.

Technical Specifications

Audio & Video Amplifiers TDF8541JS/N2,512 attributes and parameters. Explore more Audio & Video Amplifiers devices from NXP Semiconductors

Specs

General IC Type:

JESD-30 Code:

R-PZIP-T27

No. of Functions:

4

No. of Terminals:

27

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

ZIP

Package Equivalence Code:

ZIP27H,.08,.7,40

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

14.4

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

350 mA

Surface Mount:

NO

Technology:

BCDMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

TDF8541JS/N2,512 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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