Loading...

TDA18260HN/C1,551

NXP Semiconductors

TDA18260HN/C1,551 by NXP Semiconductors

TDA18260HN/C1,551 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at 3.3V with a compact 48-terminal quad package and supports peak reflow temps of 260 °C. Ideal for advanced audio and video processing in consumer electronics.

Median Price

$3.025

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics (Authorized)

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,000

-

-

-

-

Rochester

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$2.710

1k+ parts

$2.420

10k+ parts

$2.280

260

-

$2.710

$2.420

$2.280

DigiKey

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$3.130

1k+ parts

-

10k+ parts

-

260

-

$3.130

-

-

Verical

USA . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.025

10k+ parts

$2.850

260

-

-

$3.025

$2.850

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,880 parts In-Stock

1+ parts

$2.860

100+ parts

-

1k+ parts

-

10k+ parts

-

4,880

$2.860

-

-

-

Flip Electronics

USA . 28,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,000

-

-

-

-

Vyrian

USA . 8,896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,896

-

-

-

-

Anansix

USA . 1,413 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,413

-

-

-

-

DigiKey Marketplace

USA . 260 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

260

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,422 parts In-Stock

1+ parts

$2.709

100+ parts

-

1k+ parts

-

10k+ parts

-

1,422

$2.709

-

-

-

Microchip USA

USA . 275 parts In-Stock

1+ parts

$11.638

100+ parts

-

1k+ parts

-

10k+ parts

-

275

$11.638

-

-

-

UNI Independent Distributors

Spain . 6,860 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,860

-

-

-

-

Overview

Unlock unparalleled performance and reliability with the TDA18260HN/C1,551 from NXP Semiconductors. Renowned for its cutting-edge innovation, NXP delivers a versatile consumer IC that's perfect for enhancing multimedia applications. This compact, surface-mount solution ensures seamless integration into your designs, offering exceptional quality and durability. Elevate your projects with a trusted partner in technology—experience the benefits of precision and efficiency today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and cost-effectiveness, making this IC suitable for various consumer applications.

Surface Mount: YES

Being a surface-mount device allows for compact designs and easy integration into modern electronic circuits, which is ideal for space-constrained applications.

Package Shape: SQUARE

The square package shape optimizes space on printed circuit boards (PCBs), allowing for efficient layouts and potentially reducing manufacturing costs.

Power Supplies (V): 3.3

Operating at 3.3V makes this IC compatible with a wide range of low-power applications, enhancing energy efficiency and reducing heat generation.

No. of Terminals: 48

With 48 terminals, this IC provides ample connectivity options, supporting complex functionalities and enhancing its versatility in various designs.

Package Style (Meter): CHIP CARRIER

The chip carrier package style is conducive to high-density configurations and high-frequency performance, making it suitable for advanced consumer electronics.

Terminal Position: QUAD

The quad terminal position design facilitates easy routing on PCBs, improving signal integrity and minimizing potential performance issues.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C indicates the IC's suitability for lead-free soldering processes, aligning with modern environmental regulations.

Terminal Form: NO LEAD

The no-lead design supports better thermal performance and reduces parasitic effects, leading to improved overall electrical performance.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for higher I/O densities, making this product ideal for compact devices where space optimization is crucial.

Moisture Sensitivity Level (MSL): 3

An MSL rating of 3 indicates moderate sensitivity to moisture, making it suitable for standard storage and handling procedures without special precautions.

Technical Specifications

Other Function Consumer ICs TDA18260HN/C1,551 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18260HN/C1,551 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20