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TDA18260HN/C1,518

NXP Semiconductors

TDA18260HN/C1,518 by NXP Semiconductors

TDA18260HN/C1,518 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at 3.3V with a compact 48-terminal quad package and withstands peak reflow temperatures of 260 °C. Ideal for advanced multimedia systems, it ensures reliable performance in various electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 28,000 parts In-Stock

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Flip Electronics

USA . 28,000 parts In-Stock

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28,000

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Anansix

USA . 2,608 parts In-Stock

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Digiode

USA . 2,251 parts In-Stock

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Vyrian

USA . 1,911 parts In-Stock

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Microchip USA

USA . 487 parts In-Stock

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$5.157

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AZTECH Wire

Italy . 241 parts In-Stock

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$8.700

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UNI Independent Distributors

Spain . 2,160 parts In-Stock

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Corphita

USA . 664 parts In-Stock

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Overview

Unlock the future of consumer electronics with the TDA18260HN/C1,518 from NXP Semiconductors. Designed for optimal performance and reliability, this innovative IC enhances audio and video processing, making it ideal for TV, set-top boxes, and multimedia devices. With NXP's renowned quality assurance, enjoy seamless integration and robust functionality that drives user satisfaction. Elevate your products with next-level technology that empowers creativity and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact device designs, contributing to reduced PCB space and improved manufacturing efficiency.

Package Shape: SQUARE

The square package shape facilitates efficient placement and alignment during assembly, optimizing the performance of the component in spatially constrained setups.

Power Supplies (V): 3.3

A power supply of 3.3V is commonly used in many consumer electronics, ensuring compatibility and reducing the need for additional voltage regulation.

No. of Terminals: 48

With 48 terminals, this IC offers a significant number of connection points for versatile functionalities, catering to complex applications.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a reliable and efficient thermal and electrical connection, enhancing performance in demanding environments.

Terminal Position: QUAD

QUAD terminal positioning enables efficient routing and layout design on PCBs, promoting better signal integrity and performance.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows for robust soldering processes, ensuring reliable solder joints and long-term reliability.

Terminal Form: NO LEAD

No lead terminals optimize the footprint and reduce potential contamination, ensuring a cleaner integration within electronic devices.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm is ideal for high-density applications, enabling compact design while maintaining manufacturability.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, requiring standard precautions during storage and handling, which is manageable for typical production environments.

Technical Specifications

Other Function Consumer ICs TDA18260HN/C1,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18260HN/C1,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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