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TDA18254AHN/C1,518

NXP Semiconductors

TDA18254AHN/C1,518 by NXP Semiconductors

TDA18254AHN/C1,518 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at 3.3V with a max current of 295mA and supports temperatures from 0 °C to 70 °C. Ideal for compact electronic devices, it features a no-lead design in a square chip carrier package.

Median Price

$2.013

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 287,950 parts In-Stock

1+ parts

-

100+ parts

$1.800

1k+ parts

$1.610

10k+ parts

$1.510

287,950

-

$1.800

$1.610

$1.510

DigiKey

USA . 287,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.360

10k+ parts

-

287,950

-

-

$2.360

-

Verical

USA . 280,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.013

10k+ parts

$1.887

280,000

-

-

$2.013

$1.887

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,611 parts In-Stock

1+ parts

$1.881

100+ parts

-

1k+ parts

-

10k+ parts

-

4,611

$1.881

-

-

-

Vyrian

USA . 2,871 parts In-Stock

1+ parts

$1.980

100+ parts

-

1k+ parts

-

10k+ parts

-

2,871

$1.980

-

-

-

Flip Electronics

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,000

-

-

-

-

DigiKey Marketplace

USA . 7,950 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,950

-

-

-

-

Anansix

USA . 1,753 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,753

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,230 parts In-Stock

1+ parts

$1.782

100+ parts

-

1k+ parts

-

10k+ parts

-

2,230

$1.782

-

-

-

Microchip USA

USA . 7,716 parts In-Stock

1+ parts

$6.902

100+ parts

-

1k+ parts

-

10k+ parts

-

7,716

$6.902

-

-

-

UNI Independent Distributors

Spain . 5,530 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,530

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Overview

Elevate your designs with the TDA18254AHN/C1,518 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers this versatile consumer IC that seamlessly enhances performance in various applications. With its compact, surface-mount design and reliable operation across a broad temperature range, it empowers engineers to create efficient, cutting-edge solutions, ensuring exceptional value and reliability for every project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides excellent durability and protection from environmental factors, making it reliable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of circuit board space, enhancing overall product performance.

Package Shape: SQUARE

The square package shape facilitates easy integration into designs, optimizing layout for space-constrained applications.

Power Supplies (V): 3.3

Operating at a standard voltage of 3.3V makes this IC compatible with a wide range of devices and power supplies.

No. of Terminals: 48

Having 48 terminals allows for extensive connectivity options, supporting complex functionalities within a single chip.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances heat dissipation and provides a solid base for mounting in various applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for consumer electronics that may encounter moderate thermal exposure.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C ensures reliability in cooler environments, expanding its application range in consumer devices.

Terminal Position: QUAD

The quad terminal positioning allows for ease of soldering and enhances signal integrity with minimized lead length.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C guarantees compatibility with modern soldering processes, ensuring robust assembly quality.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades indicates suitability for a broad range of everyday consumer applications.

Terminal Form: NO LEAD

No lead terminals contribute to a smaller footprint and reduce the risk of lead-related issues, enhancing design flexibility.

Maximum Supply Current: 295 mA

With a maximum supply current of 295 mA, this IC can efficiently power demanding circuits while remaining energy-efficient.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for high-density designs, making it ideal for modern, compact electronics.

Moisture Sensitivity Level (MSL): 3

Having an MSL of 3 implies a moderate level of moisture sensitivity, indicating that proper handling and storage measures can be implemented effectively.

Technical Specifications

Other Function Consumer ICs TDA18254AHN/C1,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N48

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Maximum Supply Current:

295 mA

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18254AHN/C1,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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