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TDA18219HN/C1,551

NXP Semiconductors

TDA18219HN/C1,551 by NXP Semiconductors

TDA18219HN/C1,551 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at 3.3V with a min temp of -20 °C and features a quad terminal layout. Ideal for compact electronic devices, it ensures efficient performance in various environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,923 parts In-Stock

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Anansix

USA . 2,010 parts In-Stock

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Digiode

USA . 1,411 parts In-Stock

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1,411

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Distributors (Availability)

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AZTECH Wire

Italy . 1,061 parts In-Stock

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$9.240

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One Stop Electronics

USA . 1,448 parts In-Stock

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$15.800

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UNI Independent Distributors

Spain . 6,375 parts In-Stock

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6,375

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Microchip USA

USA . 5,792 parts In-Stock

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Corphita

USA . 2,451 parts In-Stock

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Overview

Unlock the full potential of your consumer electronics with the TDA18219HN/C1,551 from NXP Semiconductors. Renowned for their commitment to quality and innovation, NXP delivers a high-performance integrated circuit that enhances audio and video processing in various applications, ensuring an exceptional user experience. With its reliable design and robust features, this component promises efficiency and versatility, making it the ideal choice for modern devices. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of space on PCBs, ideal for modern electronic devices.

Package Shape: SQUARE

The square shape facilitates symmetrical layout on circuit boards, optimizing performance and thermal characteristics.

Power Supplies: 3.3 V

Operating at a low voltage of 3.3 V enhances power efficiency and reduces heat generation, making it suitable for energy-sensitive designs.

No. of Terminals: 40

With 40 terminals, this IC offers extensive connectivity options, allowing for complex functionalities in compact devices.

Package Style: CHIP CARRIER

Chip carrier packaging allows for better thermal performance and is suitable for high-speed applications.

Minimum Operating Temperature: -20 °C

A minimum operating temperature of -20 °C ensures reliable performance in cooler environments, expanding application range.

Terminal Position: QUAD

Quad terminal positioning enhances interconnectivity and simplifies the layout design, leading to improved reliability.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature ensures compatibility with various PCB manufacturing processes, enhancing production flexibility.

Terminal Form: NO LEAD

No-lead terminals contribute to a reduced environmental footprint while providing superior electrical performance and reliability.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for dense packaging of components, which is increasingly important in miniaturized electronics.

Moisture Sensitivity Level: 3

A moisture sensitivity level of 3 indicates that the device should be handled with care but can withstand controlled environments, making it adaptable to various conditions.

Technical Specifications

Other Function Consumer ICs TDA18219HN/C1,551 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18219HN/C1,551 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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