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TDA18219HN/C1,518

NXP Semiconductors

TDA18219HN/C1,518 by NXP Semiconductors

TDA18219HN/C1,518 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at 3.3V with a min temp of -20 °C and features a compact 40-terminal quad package. Ideal for enhancing audio/video performance in electronic devices.

Median Price

$1.572

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

$1.480

1k+ parts

$1.330

10k+ parts

$1.250

4,000

-

$1.480

$1.330

$1.250

Verical

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.663

10k+ parts

$1.563

4,000

-

-

$1.663

$1.563

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 207 parts In-Stock

1+ parts

$1.577

100+ parts

-

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207

$1.577

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-

Chip Stock

USA . 65,000 parts In-Stock

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65,000

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Vyrian

USA . 7,933 parts In-Stock

1+ parts

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7,933

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DigiKey Marketplace

USA . 4,000 parts In-Stock

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4,000

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Anansix

USA . 2,733 parts In-Stock

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2,733

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,505 parts In-Stock

1+ parts

$1.494

100+ parts

-

1k+ parts

-

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1,505

$1.494

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-

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AZTECH Wire

Italy . 444 parts In-Stock

1+ parts

$19.090

100+ parts

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444

$19.090

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A-Z Elektronik GmbH

Germany . 10,400 parts In-Stock

1+ parts

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10,400

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Kepictronics

USA . 8,000 parts In-Stock

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8,000

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Microchip USA

USA . 7,548 parts In-Stock

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7,548

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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GreenTree Electronics

Israel . 4,000 parts In-Stock

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4,000

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UNI Independent Distributors

Spain . 3,900 parts In-Stock

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3,900

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Overview

Elevate your consumer electronics with the TDA18219HN/C1,518 from NXP Semiconductors. This cutting-edge IC combines exceptional performance and reliability, ensuring seamless integration into a variety of applications like audio systems and smart devices. With NXP’s commitment to quality and innovation, enjoy enhanced functionality, lower power consumption, and robust design that meets the demands of today’s tech landscape, empowering you to create superior products effortlessly.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to moisture, making the product reliable in various environmental conditions.

Surface Mount: YES

Surface mount technology allows for a more compact design and automated manufacturing, which can lower production costs and improve assembly efficiency.

Package Shape: SQUARE

The square package shape is optimal for efficient space utilization on circuit boards, enabling higher density designs.

Power Supplies (V): 3.3

Operating at 3.3V is compatible with many modern microcontrollers and digital circuits, ensuring broad application potential.

No. of Terminals: 40

A higher terminal count provides more connectivity options, allowing for complex functions and integration within various systems.

Package Style (Meter): CHIP CARRIER

Chip carrier packages are ideal for high-density interconnections and provide excellent thermal performance.

Minimum Operating Temperature: -20 °C

The minimum operating temperature of -20 °C enhances the product's applicability in outdoor and industrial environments where lower temperatures are common.

Terminal Position: QUAD

Quad terminal configuration allows for optimal layout flexibility and ease of integration into various circuit designs.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C allows for compatibility with lead-free soldering processes, making it environmentally friendly and compliant with modern manufacturing standards.

Terminal Form: NO LEAD

No lead terminal design minimizes environmental impact and is compatible with current manufacturing trends towards reducing lead usage.

Terminal Pitch: 0.5 mm

A 0.5 mm pitch enables compact arrangements in high-density applications without compromising performance.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates a moderate sensitivity to moisture, allowing for reasonable handling and storage conditions, while still being suitable for automated assembly processes.

Technical Specifications

Other Function Consumer ICs TDA18219HN/C1,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N40

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

40

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.24SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA18219HN/C1,518 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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