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TDA10027HN/C1,518

NXP Semiconductors

TDA10027HN/C1,518 by NXP Semiconductors

TDA10027HN/C1,518 by NXP Semiconductors is a versatile consumer IC designed for surface mount applications. It operates at 1.2V and 3.3V with a compact 64-terminal quad package, featuring a peak reflow temp of 260 °C. Ideal for advanced multimedia processing in consumer electronics.

Median Price

$2.711

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$2.560

1k+ parts

$2.290

10k+ parts

$2.150

1,000

-

$2.560

$2.290

$2.150

Verical

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.862

10k+ parts

$2.688

1,000

-

-

$2.862

$2.688

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,536 parts In-Stock

1+ parts

$2.708

100+ parts

-

1k+ parts

-

10k+ parts

-

3,536

$2.708

-

-

-

Vyrian

USA . 4,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,940

-

-

-

-

Anansix

USA . 1,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

1,004

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,487 parts In-Stock

1+ parts

$2.565

100+ parts

-

1k+ parts

-

10k+ parts

-

2,487

$2.565

-

-

-

AZTECH Wire

Italy . 285 parts In-Stock

1+ parts

$13.850

100+ parts

-

1k+ parts

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10k+ parts

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285

$13.850

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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21,828

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UNI Independent Distributors

Spain . 7,937 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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7,937

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Microchip USA

USA . 4,150 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,150

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Overview

Unlock the potential of seamless connectivity with the TDA10027HN/C1,518 from NXP Semiconductors. Renowned for their commitment to innovation and quality, NXP delivers a consumer IC that excels in various applications, ensuring reliability and performance. This compact, surface-mount solution is designed for modern electronics, providing enhanced functionality while saving space. Elevate your designs with a trusted partner dedicated to driving efficiency and value!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making the product reliable in various applications.

Surface Mount: YES

Being surface mount compatible allows for easier integration into compact designs and contributes to reduced overall size of the circuit board.

Package Shape: SQUARE

The square shape of the package optimizes space on PCBs, aiding in layout efficiency and accommodating complex designs.

Power Supplies (V): 1.2, 3.3

Supporting multiple power supply voltages ensures versatility in application use, catering to a broader range of devices and circuits.

No. of Terminals: 64

With 64 terminals, this product allows for extensive connectivity options, enabling complex functionality and performance.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging provides a robust and reliable connection, suitable for high-performance applications requiring stable electrical contacts.

Terminal Position: QUAD

The quad terminal position enhances routing flexibility on the PCB, facilitating more efficient designs and complex interconnections.

Peak Reflow Temperature °C: 260

A high peak reflow temperature indicates the product's suitability for lead-free soldering processes, meeting modern manufacturing standards.

Terminal Form: NO LEAD

No lead design reduces environmental impact and improves solder joint reliability, making it a more sustainable choice.

Terminal Pitch: 0.5 mm

A fine terminal pitch of 0.5 mm allows for high-density designs, supporting smaller PCB layouts without compromising functionality.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates moderate moisture sensitivity, providing guidance for proper handling and storage to maintain product integrity.

Technical Specifications

Other Function Consumer ICs TDA10027HN/C1,518 attributes and parameters. Explore more Other Function Consumer ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-PQCC-N64

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

64

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC64,.35SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

Sub-Category:

Other Consumer ICs

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

TDA10027HN/C1,518 General Purpose ICs trade compliance attributes, and parameters.

ECCN

3A991.C.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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