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PMV37EN

NXP Semiconductors

PMV37EN by NXP Semiconductors

PMV37EN by NXP Semiconductors is an N-channel MOSFET designed for efficient switching applications. It features a max drain current of 3.1 A, a breakdown voltage of 30 V, and low on-resistance of 0.036 Ω. Ideal for compact electronic designs with surface mount capabilities.

Median Price

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Lifecycle Status

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6

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Chip Stock

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Vyrian

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Anansix

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Greenchips

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SIE Connect GmbH - GreenChips

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AZTECH Wire

Italy . 7,353 parts In-Stock

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One Stop Electronics

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Authorized Procurement Solutions

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Overview

Unlock unparalleled performance with the PMV37EN from NXP Semiconductors, a leader in innovative semiconductor solutions. This robust N-channel FET excels in switching applications, delivering reliability and efficiency for your projects. Its compact design and built-in diode provide versatility across various electronic devices, ensuring optimal functionality while saving space. Trust in NXP’s commitment to quality and elevate your designs with cutting-edge technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making the product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are known for their efficiency and lower on-resistance, which contribute to better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode improves circuit protection by preventing reverse current, enhancing the overall reliability of the device in various scenarios.

Transistor Application: SWITCHING

Designed for switching applications, this FET excels in operations requiring fast switching speeds, ideal for modern electronic designs.

Surface Mount: YES

Surface mount technology facilitates easy integration into compact PCB designs, saving space and improving production efficiency.

Minimum DS Breakdown Voltage: 30 V

The 30V breakdown voltage allows for safe operation in a variety of circuits, ensuring reliability even in demanding conditions.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout and soldering on PCBs, which is beneficial for maintaining signal integrity.

Terminal Form: GULL WING

Gull wing terminals provide excellent solder joint strength and thermal performance, enhancing the reliability of the device in operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode improves power efficiency as it only conducts when voltage is applied, optimizing energy usage in the application.

No. of Terminals: 3

A 3-terminal configuration simplifies circuit design while providing essential connections for drain, source, and gate.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for compact electronic devices, accommodating trends towards miniaturization in electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance, low power consumption, and fast switching speeds, making this FET versatile for a range of applications.

Transistor Element Material: SILICON

Silicon's prevalent use in FETs ensures good thermal stability and performance, making it a reliable material for semiconductor devices.

Terminal Finish: TIN

Tin finishes enhance solderability and corrosion resistance, ensuring durability and reliability in use.

Maximum Drain Current (ID): 3.1 A

A maximum drain current of 3.1 A makes this FET suitable for handling substantial loads and ensuring reliable performance in various applications.

Maximum Drain-Source On Resistance: 0.036 ohm

0.036 ohm on-resistance contributes to lower power loss and heat generation during operation, enhancing efficiency and reliability.

Terminal Position: DUAL

Dual terminal position supports flexible PCB layouts and improved circuit design options, allowing for better integration into electronic systems.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMV37EN attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

3.1 A

Maximum Drain-Source On Resistance:

.036 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMV37EN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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