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PMT200EN,135

NXP Semiconductors

PMT200EN,135 by NXP Semiconductors

PMT200EN,135 by NXP Semiconductors is an N-channel enhancement mode FET ideal for power applications. It supports a max drain current of 1.8 A and power dissipation of 8.3 W, operating up to 150 °C. This surface-mount transistor is perfect for efficient energy management in electronic devices.

Median Price

$0.080

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 16,000 parts In-Stock

1+ parts

$0.080

100+ parts

$0.075

1k+ parts

$0.068

10k+ parts

-

16,000

$0.080

$0.075

$0.068

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Verical

USA . 32,000 parts In-Stock

1+ parts

-

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$0.081

32,000

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$0.081

DigiKey

USA . 16,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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$0.080

16,000

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$0.080

Distributors (In-Stock)

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Digiode

USA . 2,373 parts In-Stock

1+ parts

$0.072

100+ parts

-

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2,373

$0.072

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Vyrian

USA . 3,624 parts In-Stock

1+ parts

$0.076

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3,624

$0.076

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Anansix

USA . 2,116 parts In-Stock

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2,116

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,848 parts In-Stock

1+ parts

$0.068

100+ parts

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3,848

$0.068

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Continental Prestige Electronics

USA . 16,000 parts In-Stock

1+ parts

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$0.091

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16,000

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$0.091

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UNI Independent Distributors

Spain . 1,175 parts In-Stock

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1,175

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Microchip USA

USA . 431 parts In-Stock

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431

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Overview

Unlock unparalleled efficiency and reliability with the PMT200EN,135 from NXP Semiconductors. Renowned for their innovative technology, NXP delivers superior power management solutions ideal for demanding applications. This N-channel FET enhances performance while ensuring thermal stability, offering businesses a competitive edge. Elevate your designs with a product that combines quality and versatility, driving optimal results in every project.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer lower on-resistance and higher efficiency, making them ideal for switching and amplification applications.

Configuration: SINGLE

A single configuration is often more compact, reducing board space requirements and simplifying circuit design.

Surface Mount: YES

Surface mount technology allows for automated assembly and is suitable for high-density circuit boards, enhancing reliability and performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs provide higher efficiency and lower power consumption, making them suitable for modern electronic applications.

Maximum Drain Current (Abs): 1.8 A

A maximum drain current of 1.8 A allows this FET to handle significant loads, making it versatile for various applications.

Maximum Power Dissipation (Abs): 8.3 W

The capability to dissipate 8.3 W means that this transistor can operate efficiently without overheating, ensuring reliability in power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power consumption, ideal for battery-operated devices and portable electronics.

Maximum Operating Temperature: 150 °C

A maximum operating temperature of 150 °C ensures that this FET can perform reliably in high-temperature environments, suitable for automotive and industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) PMT200EN,135 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1.8 A

Maximum Drain Current (ID):

1.8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

PMT200EN,135 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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