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PMT29EN,135

NXP Semiconductors

PMT29EN,135 by NXP Semiconductors

PMT29EN,135 by NXP Semiconductors is an N-channel enhancement mode FET ideal for power applications. It supports a max drain current of 6 A and power dissipation of 8.33 W, operating up to 150 °C. This surface-mount transistor is perfect for efficient energy management in electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,585 parts In-Stock

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7,585

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Digiode

USA . 4,585 parts In-Stock

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4,585

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Anansix

USA . 1,425 parts In-Stock

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1,425

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Distributors (Availability)

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AZTECH Wire

Italy . 865 parts In-Stock

1+ parts

$9.380

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865

$9.380

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One Stop Electronics

USA . 725 parts In-Stock

1+ parts

$26.050

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725

$26.050

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Component Stockers USA

USA . 671 parts In-Stock

1+ parts

$99.990

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671

$99.990

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Corphita

USA . 4,158 parts In-Stock

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4,158

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UNI Independent Distributors

Spain . 2,875 parts In-Stock

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2,875

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Microchip USA

USA . 217 parts In-Stock

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Overview

Unlock the power of efficiency with the PMT29EN,135 from NXP Semiconductors. Renowned for its innovative solutions and exceptional quality, NXP delivers this N-channel enhancement mode FET designed for superior performance in diverse applications. With a robust maximum operating temperature and impressive current handling, the PMT29EN,135 ensures reliability and longevity, making it an ideal choice for your next project. Experience unmatched value and seamless integration that enhances your designs today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally offer better performance in terms of efficiency and switching speed, making them a preferred choice for high-speed applications.

Configuration: SINGLE

Single configuration is ideal for applications requiring simplicity and lower overall circuit complexity, reducing design effort and space.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient PCB usage, making it suitable for modern electronics where space is at a premium.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be turned on by applying a gate voltage, allowing for low power consumption and effective signal control.

Maximum Drain Current (Abs) (ID): 6 A

With a maximum drain current rating of 6 A, this FET can handle substantial loads, making it versatile for various applications, from consumer electronics to industrial controls.

Maximum Power Dissipation (Abs): 8.33 W

A power dissipation rating of 8.33 W enables effective thermal management and the ability to handle demanding conditions without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology provides high input impedance and low power requirements, enhancing performance characteristics in various applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150 °C makes this product reliable in harsh environments, allowing for increased operational flexibility.

Technical Specifications

Power Field Effect Transistors (FET) PMT29EN,135 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

6 A

Maximum Drain Current (ID):

6 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

PMT29EN,135 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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