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PMT200EN,115

NXP Semiconductors

PMT200EN,115 by NXP Semiconductors

NXP Semiconductors' PMT200EN,115 is a N-CHANNEL FET with 1.8A ID and 8.3W power dissipation. Ideal for applications requiring high drain current and operating at up to 150°C, this single configuration MOSFET offers enhanced performance in surface mount designs.

Median Price

$0.080

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25,828 parts In-Stock

1+ parts

$0.080

100+ parts

$0.075

1k+ parts

$0.068

10k+ parts

-

25,828

$0.080

$0.075

$0.068

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DigiKey

USA . 25,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.080

25,828

-

-

-

$0.080

Verical

USA . 25,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.081

25,828

-

-

-

$0.081

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,198 parts In-Stock

1+ parts

$0.072

100+ parts

-

1k+ parts

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10k+ parts

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4,198

$0.072

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-

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Vyrian

USA . 1,008 parts In-Stock

1+ parts

$0.076

100+ parts

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1,008

$0.076

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Anansix

USA . 2,843 parts In-Stock

1+ parts

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2,843

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,737 parts In-Stock

1+ parts

$0.068

100+ parts

-

1k+ parts

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10k+ parts

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2,737

$0.068

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-

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

1+ parts

$2.277

100+ parts

$2.072

1k+ parts

$1.867

10k+ parts

-

5,000

$2.277

$2.072

$1.867

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Continental Prestige Electronics

USA . 25,828 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.091

10k+ parts

-

25,828

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$0.091

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UNI Independent Distributors

Spain . 1,612 parts In-Stock

1+ parts

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1,612

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Overview

Unleash the power of innovation with the PMT200EN,115 by NXP Semiconductors. Designed with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance and reliability for a wide range of applications. From enhancing efficiency in power supplies to optimizing motor control systems, this FET is a game-changer. Experience superior quality, increased functionality, and unmatched value with the PMT200EN,115. Choose NXP Semiconductors for cutting-edge technology that delivers results.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them a good choice for power applications.

Configuration: SINGLE

Single configuration FETs are commonly used in simple circuit designs and are easy to work with, making them suitable for various applications.

Surface Mount: YES

Surface mount FETs are compact, easy to solder, and enable high-density PCB designs, providing convenience and efficiency in assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off until a suitable gate voltage is applied, offering better control and efficiency in switching applications.

Maximum Drain Current (ID): 1.8 A

With a maximum drain current of 1.8A, this FET can handle moderate power loads, making it suitable for a wide range of applications.

Maximum Power Dissipation: 8.3 W

With a maximum power dissipation of 8.3W, this FET can handle high power levels without overheating, ensuring reliable performance in demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer low gate capacitance, fast switching speeds, and high input impedance, making them ideal for high-frequency applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand elevated temperatures, ensuring stability and performance in harsh environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability, corrosion resistance, and conductivity, ensuring reliable electrical connections and durability.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, this FET is easy to solder and suitable for automated assembly processes.

Peak Reflow Temperature: 260

With a peak reflow temperature of 260°C, this FET can be soldered using standard lead-free processes, ensuring compatibility and ease of manufacturing.

Technical Specifications

Power Field Effect Transistors (FET) PMT200EN,115 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

1.8 A

Maximum Drain Current (ID):

1.8 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

PMT200EN,115 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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