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PMBFJ109T/R

NXP Semiconductors

PMBFJ109T/R by NXP Semiconductors

PMBFJ109T/R by NXP Semiconductors is a small signal N-CHANNEL FET for switching applications. It features a min DS Breakdown Voltage of 25V, Max Power Dissipation of 0.25W, and Max Operating Temperature of 150°C. With a DEPLETION MODE operating mode, this transistor is ideal for surface mount applications requiring low drain-source resistance.

Median Price

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Lifecycle Status

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4

In-Stock Inventory

1k+

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Anansix

USA . 2,548 parts In-Stock

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Vyrian

USA . 602 parts In-Stock

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Digiode

USA . 251 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Corohmni

South Africa . 808 parts In-Stock

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$1.901

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AZTECH Wire

Italy . 559 parts In-Stock

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$15.108

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Ampacity Inc.

Singapore . 1,161 parts In-Stock

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$22.050

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One Stop Electronics

USA . 1,373 parts In-Stock

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$47.050

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UNI Independent Distributors

Spain . 3,818 parts In-Stock

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Corphita

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Continental Prestige Electronics

USA . 2,087 parts In-Stock

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Argo Parts USA

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Discover the cutting-edge technology of the NXP Semiconductors PMBFJ109T/R Small Signal Field Effect Transistor! This high-quality component offers unmatched performance in switching applications, thanks to its N-channel configuration and depletion mode operation. With a maximum power dissipation of 0.25W and a minimum DS breakdown voltage of 25V, this transistor provides reliable and efficient operation. Whether you're working on consumer electronics or industrial equipment, the PMBFJ109T/R is the perfect choice for your project, offering exceptional value and performance that exceeds expectations. Upgrade your designs with NXP Semiconductors today!

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type:

N-CHANNEL - Offers efficient performance and control in switching applications.

Configuration:

SINGLE - Simplifies circuit design and integration, ideal for straightforward applications.

Transistor Application:

SWITCHING - Ensures fast and reliable switching operation for optimal performance.

Surface Mount:

YES - Enables easy and efficient soldering onto PCBs, saving time and effort during assembly.

Minimum DS Breakdown Voltage:

25 V - Provides a high breakdown voltage for handling high-power applications.

Package Shape:

RECTANGULAR - Facilitates easy placement and mounting on PCBs for space-saving layouts.

Terminal Form:

GULL WING - Offers secure and reliable connections for consistent performance.

Operating Mode:

DEPLETION MODE - Allows for precise control and regulation of the transistor's operation.

No. of Terminals:

3 - Simplifies connection and integration into circuits with minimal terminals required.

Maximum Power Dissipation (Abs):

0.25 W - Ensures efficient power handling capability for reliable operation under load.

Package Style (Meter):

SMALL OUTLINE - Compact design for space-constrained applications without compromising performance.

Field Effect Transistor Technology:

JUNCTION - Utilizes advanced junction technology for improved performance and reliability.

Maximum Operating Temperature:

150 °C - Offers a wide temperature range for operation in various environments.

Transistor Element Material:

SILICON - Ensures high performance and reliability with premium material construction.

Terminal Finish:

TIN - Provides a durable and corrosion-resistant finish for long-lasting reliability.

Maximum Drain-Source On Resistance:

12 ohm - Offers low resistance for efficient power delivery and performance.

Terminal Position:

DUAL - Allows for versatile mounting and connection options to suit different circuit configurations.

Peak Reflow Temperature °C:

260 - Withstands high reflow temperatures for reliable soldering and manufacturing processes.

Maximum Feedback Capacitance (Crss):

15 pF - Provides low feedback capacitance for improved signal integrity and performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMBFJ109T/R attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Configuration:

Minimum DS Breakdown Voltage:

25 V

Maximum Drain-Source On Resistance:

12 ohm

Field Effect Transistor Technology:

JUNCTION

Maximum Feedback Capacitance (Crss):

15 pF

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMBFJ109T/R Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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