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PMBF107-TAPE-13

NXP Semiconductors

PMBF107-TAPE-13 by NXP Semiconductors

PMBF107-TAPE-13 by NXP Semiconductors is an N-channel FET designed for switching applications. It features a 200V min DS breakdown voltage, 0.1A max drain current, and operates at up to 150 °C. This surface-mount transistor ensures efficient performance in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 2,904 parts In-Stock

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Vyrian

USA . 1,799 parts In-Stock

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Anansix

USA . 195 parts In-Stock

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195

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One Stop Electronics

USA . 1,026 parts In-Stock

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$21.050

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$21.050

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UNI Independent Distributors

Spain . 7,379 parts In-Stock

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Corphita

USA . 4,332 parts In-Stock

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Overview

Elevate your designs with the PMBF107-TAPE-13 from NXP Semiconductors, a trusted leader in innovation. This high-quality N-channel FET offers exceptional switching performance and reliability, ensuring your projects run smoothly. Its compact surface mount design makes it ideal for space-constrained applications, while its built-in diode adds versatility. Choose the PMBF107-TAPE-13 for unmatched quality, efficiency, and peace of mind in every application!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy construction offers durability and reliability, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are favored for their higher efficiency and better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides protection against reverse current, enhancing the reliability of the device.

Transistor Application: SWITCHING

Optimized for switching applications, this transistor can efficiently control power in various circuits.

Surface Mount: YES

Surface mount capability allows for compact circuit designs and automated assembly, reducing manufacturing costs.

Minimum DS Breakdown Voltage: 200 V

With a high breakdown voltage, this FET can safely operate in high-voltage applications without failure.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on PCB layouts.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and reliable connections, crucial for effective circuit operation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation results in lower power consumption and better switching characteristics.

No. of Terminals: 3

The 3-terminal design simplifies integration into circuits while providing essential functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package enables high-density circuit designs, vital for modern electronics.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOS technology ensures high input impedance and lower power for enhanced performance in digital circuits.

Maximum Operating Temperature: 150 °C

A high maximum temperature rating ensures reliable performance in demanding environments.

Transistor Element Material: SILICON

Silicon material is widely used, providing good thermal stability and excellent electrical properties.

Maximum Drain Current (ID): 0.1 A

This drain current rating is suitable for low to moderate power applications, enhancing versatility.

Maximum Drain-Source On Resistance: 28 ohm

Relatively low on-resistance minimizes power loss and increases efficiency during operation.

Maximum Feedback Capacitance (Crss): 10 pF

Low feedback capacitance is beneficial for high-speed switching applications, improving circuit performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) PMBF107-TAPE-13 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (ID):

.1 A

Maximum Drain-Source On Resistance:

28 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

10 pF

JESD-30 Code:

R-PDSO-G3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

PMBF107-TAPE-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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