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PDTC114ET,215

NXP Semiconductors

PDTC114ET,215 by NXP Semiconductors

The NXP Semiconductors PDTC114ET,215 is a NPN BJT transistor with VCEsat of 0.3V and hFE of 30. It is ideal for switching applications, featuring a max IC of 0.1A and operating temperature up to 150°C. The package style is small outline with GULL WING terminals, suitable for surface mount assembly.

Median Price

$0.046

Lifecycle Status

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32

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1k+

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Newark

USA . 104 parts In-Stock

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$0.261

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Chip1Stop

Japan . 7,699 parts In-Stock

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$0.273

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$0.014

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Elektronika Sales Private Limited

India . 4,869,000 parts In-Stock

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EBV Elektronik

Germany . 3,177,000 parts In-Stock

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TTI

USA . 1,284,000 parts In-Stock

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Future Electronics

Canada . 138,000 parts In-Stock

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Verical

USA . 90,000 parts In-Stock

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RS (Exports)

UK . 78,000 parts In-Stock

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Element14

Singapore . 26,974 parts In-Stock

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Farnell

UK . 20,120 parts In-Stock

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Rochester

USA . 1,550 parts In-Stock

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Arrow

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Digiode

USA . 2,457 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Bristol Electronics

USA . 3,095 parts In-Stock

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Maritex

Poland . 6,000 parts In-Stock

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IBS Electronics

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NAC Semi

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DigiKey Marketplace

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Micros

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Partservice

France . 69,000 parts In-Stock

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Micros sp.j. W. Kędra i J. Lic

Poland . 54,940 parts In-Stock

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LIBRA Elektronik GmbH

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Electronic Treasures

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India . 1,688,203 parts In-Stock

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Corphita

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AZTECH Wire

Italy . 12,507 parts In-Stock

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Aranea Global

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Microchip USA

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Aztec Data Supply Inc.

USA . 920 parts In-Stock

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Advanced Electronics

New Zealand . 300 parts In-Stock

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Corohmni

South Africa . 370 parts In-Stock

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Modulus Dynamics

Lithuania . 8,319 parts In-Stock

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Perfect Parts

USA . 8,065,712 parts In-Stock

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Glotronic Ltd.

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RC Electronics

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GreenTree Electronics

Israel . 456,000 parts In-Stock

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Continental Prestige Electronics

USA . 241,404 parts In-Stock

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Futuretech Components

Singapore . 231,000 parts In-Stock

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Allen Electronics Distributors

USA . 78,000 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 57,603 parts In-Stock

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iodParts Technologies Inc.

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Lucentia Tech

USA . 49,628 parts In-Stock

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Authorized Procurement Solutions

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Robosynatics

Brazil . 24,814 parts In-Stock

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Supply Digital

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Overview

Enhance your electronic projects with the NXP Semiconductors PDTC114ET,215 Small Signal Bipolar Junction Transistor. This high-quality component, known for its reliability and durability, features a built-in resistor and NPN configuration, making it ideal for switching applications. With a low VCEsat of 0.3V and maximum collector current of 0.1A, this transistor ensures efficient performance. Whether you're a hobbyist or a professional, this product offers value, benefits, and advantages that will take your projects to the next level. Upgrade your designs today with the PDTC114ET,215 and experience the difference in quality.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides excellent mechanical strength and insulation, making the transistor durable and reliable in various operating conditions.

Polarity or Channel Type: NPN

NPN type transistors are commonly used for amplification and switching applications, offering good performance and efficiency.

Configuration: SINGLE WITH BUILT-IN RESISTOR

The built-in resistor simplifies circuit design by reducing the need for external components, making it more convenient and cost-effective for circuits requiring a resistor.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers fast switching speeds and high efficiency, making it ideal for use in various electronic devices that require rapid switching.

Surface Mount: YES

Being surface mountable, this transistor is easy to install on printed circuit boards, saving space and facilitating automated assembly processes.

Maximum VCEsat: 0.3 V

With a low VCEsat value of 0.3 V, this transistor offers low saturation voltage, resulting in minimal power loss and higher efficiency in switching applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and space-saving integration, making it suitable for compact electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable solder connection, ensuring consistent electrical performance and mechanical stability.

Maximum Power Dissipation (Abs): 0.25 W

With a maximum power dissipation of 0.25 W, this transistor can handle moderate power levels without overheating, ensuring reliable operation in various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers space-saving benefits and easy integration, making it suitable for compact electronic designs with limited board space.

Minimum DC Current Gain (hFE): 30

The minimum DC current gain of 30 ensures stable and consistent amplification capabilities, making it a reliable choice for signal amplification applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand high-temperature environments, ensuring reliable performance in various operating conditions.

Maximum Collector-Base Capacitance: 3.5 pF

The low collector-base capacitance of 3.5 pF minimizes the risk of parasitic capacitance effects, ensuring high-frequency performance and stability in RF applications.

Maximum Collector-Emitter Voltage: 50 V

With a maximum collector-emitter voltage of 50 V, this transistor can handle moderate voltage levels, making it suitable for various switching and amplification applications.

Transistor Element Material: SILICON

Silicon material offers excellent thermal and electrical properties, providing high reliability and performance in a wide range of operating conditions.

Maximum Collector Current (IC): 0.1 A

With a maximum collector current of 0.1 A, this transistor can handle moderate current levels, making it suitable for various low-power applications.

Terminal Finish: TIN

The tin terminal finish ensures good solderability and corrosion resistance, maintaining a reliable electrical connection and long-term performance.

Terminal Position: DUAL

The dual terminal position allows for versatile mounting and connection options, providing flexibility in circuit design and layout for different applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and thermal stability during assembly processes, reducing the risk of damage to the transistor.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can withstand high-temperature soldering processes without degradation, ensuring reliable assembly and performance.

Nominal Transition Frequency (fT): 100 MHz

The high nominal transition frequency of 100 MHz indicates the transistor's capability for high-speed signal processing and amplification, making it suitable for RF and high-frequency applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) PDTC114ET,215 attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

BUILT-IN BIAS RESISTOR RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

3.5 pF

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

30

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.3 V

Trade Compliance

PDTC114ET,215 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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