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PDTC114ET

NXP Semiconductors

PDTC114ET by NXP Semiconductors

The NXP Semiconductors PDTC114ET is a NPN BJT transistor with VCEsat of 0.3V, hFE of 30, and IC of 0.1A. Ideal for switching applications due to its built-in resistor and small outline package style. With a max operating temperature of 150°C, it offers reliable performance in various electronic circuits.

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Advanced Electronics

New Zealand . 600 parts In-Stock

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Overview

Unlock the power of innovation with the PDTC114ET by NXP Semiconductors. Designed to deliver exceptional performance in switching applications, this NPN transistor boasts a built-in resistor for seamless integration. The small outline package and gull wing terminals make installation a breeze, while the maximum VCEsat of just 0.3V ensures efficient operation. With a wide operating temperature range and superior quality construction, this transistor is the perfect choice for your next project. Experience the reliability and precision of NXP Semiconductors with the PDTC114ET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material for long-lasting performance.

Polarity or Channel Type: NPN

Suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN RESISTOR

Simplifies circuit design and saves space.

Transistor Application: SWITCHING

Ideal for fast switching operations.

Surface Mount: YES

Easy to assemble and suitable for compact designs.

Maximum VCEsat: 0.3 V

Low voltage drop for efficient operation.

Package Shape: RECTANGULAR

Standard shape for easy integration into circuits.

Terminal Form: GULL WING

Easy to solder and secure connection.

No. of Terminals: 3

Simple and straightforward to use.

Maximum Power Dissipation (Abs): 0.25 W

Handles power efficiently without overheating.

Package Style (Meter): SMALL OUTLINE

Space-saving design for compact applications.

Minimum DC Current Gain (hFE): 30

Consistent performance across various currents.

Maximum Operating Temperature: 150 °C

Operates reliably in high-temperature environments.

Maximum Collector-Base Capacitance: 3.5 pF

Low capacitance for better high-frequency performance.

Maximum Collector-Emitter Voltage: 50 V

Handles high voltages without issues.

Transistor Element Material: SILICON

Reliable material for consistent performance.

Maximum Collector Current (IC): 0.1 A

Handles moderate currents effectively.

Terminal Finish: Tin (Sn)

Corrosion-resistant finish for durability.

Terminal Position: DUAL

Offers flexibility in connection options.

Maximum Time At Peak Reflow Temperature (s): 30

Easy to work with during assembly.

Peak Reflow Temperature °C: 260

Withstands high temperatures during soldering.

Nominal Transition Frequency (fT): 100 MHz

Suitable for high-frequency applications.

Technical Specifications

Small Signal Bipolar Junction Transistors (BJT) PDTC114ET attributes and parameters. Explore more Small Signal Bipolar Junction Transistors (BJT) devices from NXP Semiconductors

Specs

Additional Features:

BUILT IN BIAS RESISTANCE RATIO IS 1

Maximum Collector Current (IC):

Maximum Collector-Base Capacitance:

3.5 pF

Maximum Collector-Emitter Voltage:

50 V

Minimum DC Current Gain (hFE):

30

JEDEC-95 Code:

TO-236AB

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

BIP General Purpose Small Signal

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Maximum VCEsat:

.3 V

Trade Compliance

PDTC114ET Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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