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PCF8811MU/2DA/1,02

NXP Semiconductors

PCF8811MU/2DA/1,02 by NXP Semiconductors

PCF8811MU/2DA/1,02 by NXP Semiconductors is a CMOS interface IC designed for segment displays. It operates at 1.8/3.3V with a max current of 0.25mA and supports up to 128 segments across an industrial temp range of -40 °C to 85 °C, ideal for robust applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,923 parts In-Stock

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Digiode

USA . 4,941 parts In-Stock

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Anansix

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Microchip USA

USA . 434 parts In-Stock

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One Stop Electronics

USA . 1,173 parts In-Stock

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AZTECH Wire

Italy . 939 parts In-Stock

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Corphita

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Overview

Elevate your designs with the PCF8811MU/2DA/1,02 from NXP Semiconductors—a trusted leader in innovation. This versatile interface IC is engineered for superior performance across a wide temperature range, making it ideal for industrial applications. With its low power consumption and efficient 128-segment display capabilities, it enhances product functionality while ensuring reliability. Choose NXP for quality you can trust and unlock endless possibilities for your next project!

Feature Benefit Bullets

Display Mode: SEGMENT

The SEGMENT display mode allows for clear and easy-to-read information presentation, suitable for a wide range of applications.

Power Supplies (V): 1.8/3.3

Dual voltage supply options make this IC versatile for different system requirements and power configurations.

No. of Backplanes: 80-BP

With 80 backplanes, this IC can handle complex display configurations, enabling detailed and intricate display designs.

Maximum Operating Temperature: 85 °C

A high maximum operating temperature makes this product suitable for demanding environments, ensuring reliability under heat.

Minimum Operating Temperature: -40 °C

The capability to operate at extremely low temperatures makes this IC ideal for outdoor and harsh environment applications.

Temperature Grade: INDUSTRIAL

An industrial temperature grade ensures reliable performance across a wide range of operating conditions, making it long-lasting in critical applications.

Technology: CMOS

CMOS technology offers low power consumption and high integration, providing efficiency and performance for advanced applications.

Maximum Supply Current: 0.25 mA

A low maximum supply current ensures extended battery life and reduced power consumption, making the product ideal for portable devices.

No. of Segments: 128

Having 128 segments enables detailed and more informative displays, making this IC a great choice for applications requiring extensive visual data.

Technical Specifications

Other Function Interface ICs PCF8811MU/2DA/1,02 attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Display Mode:

SEGMENT

No. of Backplanes:

80-BP

No. of Segments:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Equivalence Code:

DIE OR CHIP

Power Supplies (V):

1.8/3.3

Qualification:

Not Qualified

Sub-Category:

Other Interface ICs

Maximum Supply Current:

.25 mA

Technology:

CMOS

Temperature Grade:

Trade Compliance

PCF8811MU/2DA/1,02 Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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