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P4080NSN7PNC

NXP Semiconductors

P4080NSN7PNC by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 16;

Median Price

$823.875

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 137 parts In-Stock

1+ parts

$659.100

100+ parts

$619.550

1k+ parts

$580.010

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137

$659.100

$619.550

$580.010

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Verical

USA . 63 parts In-Stock

1+ parts

$823.875

100+ parts

$774.438

1k+ parts

$725.013

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-

63

$823.875

$774.438

$725.013

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DigiKey

USA . 1 parts In-Stock

1+ parts

$823.880

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1

$823.880

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Distributors (In-Stock)

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Digiode

USA . 1,022 parts In-Stock

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$632.472

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$632.472

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DigiKey Marketplace

USA . 1 parts In-Stock

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$884.420

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1

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Vyrian

USA . 8,944 parts In-Stock

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Flip Electronics

USA . 6,568 parts In-Stock

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Chip Stock

USA . 145 parts In-Stock

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145

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Anansix

USA . 106 parts In-Stock

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Bristol Electronics

USA . 9 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 1 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 38 parts In-Stock

1+ parts

$486.540

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38

$486.540

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Corphita

USA . 2,688 parts In-Stock

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$599.184

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2,688

$599.184

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Microchip USA

USA . 1,409 parts In-Stock

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$897.919

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1,409

$897.919

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Vigor

Singapore . 276 parts In-Stock

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$1,377.530

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276

$1,377.530

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Authorized Procurement Solutions

USA . 9,000 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,861 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 4 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 2 parts In-Stock

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Technical Specifications

Microprocessors P4080NSN7PNC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Boundary Scan:

YES

Maximum Clock Frequency:

133.3 MHz

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B1295

JESD-609 Code:

e1

Length:

37.5 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Maximum Seated Height:

3.53 mm

Speed:

1500 rpm

Maximum Supply Voltage:

1.05 V

Minimum Supply Voltage:

.95 V

Nominal Supply Voltage:

1 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

37.5 mm

Peripheral IC Type:

Trade Compliance

P4080NSN7PNC Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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