Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Moisture Sensitivity Level (MSL): 3;
Median Price
$512.510
Lifecycle Status
Suppliers In-Stock
10
In-Stock Inventory
1k+
Verical
1+ parts
$162.210
100+ parts
-
1k+ parts
10k+ parts
Rochester
$481.760
$451.010
DigiKey
$557.080
Flip Electronics (Authorized)
Digiode
$304.712
Vyrian
$320.750
DigiKey Marketplace
$598.000
Anansix
Flip Electronics
ACDS - Activité Composants Distribution Service
Semicontronic
$272.640
$265.824
$264.461
Corphita
$288.675
Vigor
$501.760
Microchip USA
$607.134
UNI Independent Distributors
Authorized Procurement Solutions
A-Z Elektronik GmbH
Futuretech Components
Perfect Parts
Cyclops Electronics Ltd (Excess)
Glotronic Ltd.
Microprocessors P4080NSE7MMC attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors
Address Bus Width:
Boundary Scan:
Maximum Clock Frequency:
External Data Bus Width:
Format:
Integrated Cache:
JESD-30 Code:
JESD-609 Code:
Length:
Low Power Mode:
Moisture Sensitivity Level (MSL):
No. of Terminals:
Package Body Material:
Package Code:
Package Shape:
Package Style (Meter):
Peak Reflow Temperature (C):
Maximum Seated Height:
Speed:
Maximum Supply Voltage:
Minimum Supply Voltage:
Nominal Supply Voltage:
Surface Mount:
Technology:
Terminal Finish:
Terminal Form:
Terminal Pitch:
Terminal Position:
Maximum Time At Peak Reflow Temperature (s):
Width:
Peripheral IC Type:
P4080NSE7MMC Peripheral ICs trade compliance attributes, and parameters.
ECCN
5A002.A.1
ECCN Governance
EAR
HTS
8542.31.00.01
SB
8542.31.00.00
NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.
Executive Director, President, CEO
Kurt Sievers
Executive VP, CFO
Bill Betz
Executive VP, Chief Sales Officer
Ron Martino
ICN8
Fabrication
Fab Initiation
1996
Netherlands
Nijmegen
Wafer Capacity
55,000
ATMC (Austin Tech & Mfg Center)
1995
USA
Austin
30,000
N/A
1989
Germany
Boeblingen
CHD
1993
Chandler
OHTC
1991
24,000
New Expansion Fab
2026
ECHO
2020
10,000
LL4148
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CN
National Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
2N2222A
Motorola
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Collector-Base Capacitance: 8 pF;
Shanghai Lunsure Electronic Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): 1 V; Maximum Non Repetitive Peak Forward Current: .5 A; No. of Elements: 1; Maximum Reverse Recovery Time: .004 us;
LM555CM
Harris Semiconductor
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58-360
Itt Cannon
CONNECTOR ACCESSORY; Alternate Contacts: 030-2042-000; DIN Conformity: NO; Contact Gender: MALE; Terminal Type: WIRE; MIL-Connector Accessory Name: CONTACT;
RC0805FR-0710KL
Yageo
Yageo's RC0805FR-0710KL is a 10000 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. Ideal for applications requiring resistance to operate b/w -55°C to 155°C, such as in automotive electronics or industrial control systems. Features metal glaze/thick film technology and matte tin finish with nickel barrier.
SS14
Dc Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
Silicon Transistor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
NE555D
NXP Semiconductors
SQUARE; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: LSOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99
Philips Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LM358N
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
BSS138
Good-ark Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain-Source On Resistance: 6 ohm; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
Meritek Electronics
MMBF170LT1G
Onsemi
MMBF170LT1G by Onsemi is a N-CHANNEL FET with 60V DS Breakdown Voltage and 0.5A Drain Current. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 0.225W. This small outline transistor has a temperature range from -55 to 150 °C.
1N4148
Hitano Enterprise
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
CM8064601481957SR1PA
Intel
MICROPROCESSOR;
MC7448TVU1267ND
Freescale Semiconductor
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE; Boundary Scan: YES;
LX2160XC72232B
The NXP Semiconductors LX2160XC72232B microprocessor features a 64-bit architecture with 128 external data bus width and integrated cache. It is designed for industrial applications, offering low power mode and operating temperature range from -40 to 105°C. With 1517 terminals in a grid array package style, it supports boundary scan and RISC technology for efficient performance.
MPC8347VVAJFB
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 672; Package Code: LBGA; Package Shape: SQUARE;
P1010NXE5HHA
The NXP Semiconductors P1010NXE5HHA microprocessor features a 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for industrial applications, it operates at temperatures ranging from -40 to 105°C with a max supply voltage of 1.05V. This microprocessor is designed in a square package style with 425 terminals for surface mount assembly.
MPC880ZP80
The NXP Semiconductors MPC880ZP80 microprocessor features 32-bit address and data bus width, with integrated cache and low power mode. It is a RISC-based processor with 357 terminals in a grid array package suitable for various applications requiring high-speed processing capabilities.
MCIMX6S6AVM08AD
MCIMX6S6AVM08AD by NXP Semiconductors is a Microprocessor with 32-bit external data bus width, 16-bit address bus width, and integrated cache. Ideal for automotive applications due to its low power mode, operating temperature range of -40 to 125 °C, and boundary scan feature.
MCF54452VR266
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 360; Package Code: BGA; Package Shape: SQUARE;
MCF54450VM240J
MCF54450VM240J by Freescale Semiconductor is a 32-bit microprocessor with integrated cache and 16-bit external data bus width. It features a package style of grid array, low profile, and operates at speeds up to 240 rpm. Ideal for applications requiring low power mode and commercial temperature grade.
ADSP-21488KSWZ-4B
Analog Devices
ADSP-21488KSWZ-4B by Analog Devices is a 40-bit microprocessor with 24-bit address bus width, 16-bit external data bus width, and integrated cache. It operates at a max clock frequency of 25 MHz and is suitable for commercial-grade applications requiring high-speed processing in compact form factors.
P1011NSN2DFB
The NXP Semiconductors P1011NSN2DFB microprocessor features a 32-bit architecture with integrated cache and 16-bit address bus width. It is designed for applications requiring high-speed processing, with a max supply voltage of 1.05 V and external data bus width of 32 bits. The package style is grid array, making it suitable for surface mount configurations in various electronic devices.
P1014NXE5HFB
P1014NXE5HFB by NXP Semiconductors is a 32-bit microprocessor with integrated cache, operating at a max clock frequency of 100 MHz. This processor features low power mode and boundary scan capabilities, making it ideal for applications requiring high-speed processing in compact devices. With a package style of grid array and fine pitch, this chip offers advanced performance in a small form factor.
STM32MP151FAC1
STMicroelectronics
MICROPROCESSOR, RISC;
MIMXRT595SFFOCR
MICROPROCESSOR, RISC; Moisture Sensitivity Level (MSL): 3; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260;
MC9328MXLVH15
MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 256; Package Code: LFBGA; Package Shape: SQUARE;
ADSP-21488KSWZ-4B1
ADSP-21488KSWZ-4B1 by Analog Devices is a 40-bit microprocessor with 24-bit address bus width and 16-bit external data bus width. It operates at a max clock frequency of 25 MHz, making it suitable for applications requiring high-speed processing in commercial temperature environments. The package style includes flatpack, heat sink/slug, low profile, and fine pitch options for versatile integration.
MPC860DEZQ50D4
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Maximum Time At Peak Reflow Temperature (s): 30;
STM32MP153AAC3T
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): NOT SPECIFIED; Peak Reflow Temperature (C): NOT SPECIFIED;
AM5728BABCXA
Texas Instruments
AM5728BABCXA by Texas Instruments is a microprocessor with 32-bit external data bus width, operating at max 38.4 MHz clock frequency. Ideal for industrial applications, it features a low power mode and operates in an extended temperature range from -40 to 105°C.
MIMXRT106SCVL5B
MICROPROCESSOR, RISC; Maximum Time At Peak Reflow Temperature (s): 40; Peak Reflow Temperature (C): 260; Moisture Sensitivity Level (MSL): 3;
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P4080NSE7PNC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Technology: CMOS;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Maximum Clock Frequency: 133.3 MHz;
P4080NXE7MMC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Length: 37.5 mm;
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Speed: 1200 rpm;
P4080NSN1NNB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Speed: 1333 rpm;
P4080NXE7PNAC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Terminal Pitch: 1 mm;
P4080NXN7MMC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Maximum Seated Height: 3.53 mm;
P4080PSE1MMB
MICROPROCESSOR; Temperature Grade: OTHER; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE;
P4080NSE1NNB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Terminal Finish: TIN SILVER COPPER;
P4080NSE7PNAC
P4080NSE7PNAC by NXP Semiconductors is a Microprocessor with 32-bit Address Bus, 16-bit External Data Bus, and 133.3 MHz Clock Frequency. It is suitable for applications requiring high-speed processing in compact devices due to its low power mode and integrated cache feature. The package style of GRID ARRAY makes it ideal for surface mount assembly in various electronic products.
P4080NSN7MMC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; JESD-609 Code: e1;
P4080NSN7PNAC
P4080NSN7PNC
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; External Data Bus Width: 16;
P4080NSN1MMB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Terminal Position: BOTTOM;
P4080NXN1MMB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Surface Mount: YES;
P4080NSN1PNB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Format: FIXED POINT;
P4080NSE1MMB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Integrated Cache: YES;
P4080NSE1PNB
P4080NXE1MMB
MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 1295; Package Code: BGA; Package Shape: SQUARE; Width: 37.5 mm;
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