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N74F574D,623

NXP Semiconductors

N74F574D,623 by NXP Semiconductors

BUS DRIVER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 20; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

$0.394

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,695 parts In-Stock

1+ parts

-

100+ parts

$0.387

1k+ parts

$0.321

10k+ parts

$0.286

2,695

-

$0.387

$0.321

$0.286

Verical

USA . 1,953 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.401

10k+ parts

$0.357

1,953

-

-

$0.401

$0.357

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 318 parts In-Stock

1+ parts

$0.155

100+ parts

-

1k+ parts

-

10k+ parts

-

318

$0.155

-

-

-

Vyrian

USA . 7,004 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,004

-

-

-

-

Anansix

USA . 1,138 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,138

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,962 parts In-Stock

1+ parts

$0.139

100+ parts

-

1k+ parts

-

10k+ parts

-

2,962

$0.139

-

-

-

Corphita

USA . 2,329 parts In-Stock

1+ parts

$0.147

100+ parts

-

1k+ parts

-

10k+ parts

-

2,329

$0.147

-

-

-

Component Stockers USA

USA . 1,253 parts In-Stock

1+ parts

$0.170

100+ parts

$0.160

1k+ parts

$0.140

10k+ parts

-

1,253

$0.170

$0.160

$0.140

-

Andel Nordic

Denmark . 612 parts In-Stock

1+ parts

$6.230

100+ parts

-

1k+ parts

$5.980

10k+ parts

$5.980

612

$6.230

-

$5.980

$5.980

AZTECH Wire

Italy . 1,162 parts In-Stock

1+ parts

$13.350

100+ parts

-

1k+ parts

-

10k+ parts

-

1,162

$13.350

-

-

-

Microchip USA

USA . 1,358 parts In-Stock

1+ parts

$18.458

100+ parts

-

1k+ parts

-

10k+ parts

-

1,358

$18.458

-

-

-

UNI Independent Distributors

Spain . 8,243 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,243

-

-

-

-

Perfect Parts

USA . 2,188 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,188

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-

-

Technical Specifications

Bus Driver & Transceivers N74F574D,623 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

BROADSIDE VERSION OF 374; POWER OFF DISABLE OUTPUTS TO PERMIT LIVE INSERTION

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

70 mA

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

N74F574D,623 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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