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N74F1245D-T

NXP Semiconductors

N74F1245D-T by NXP Semiconductors

N74F1245D-T by NXP Semiconductors is an 8-bit bus driver with a 5V nominal voltage and a propagation delay of just 8 ns. It features dual ports, operates in temperatures from 0 °C to 70 °C, and supports true output polarity. Ideal for high-speed data transmission in compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 4,201 parts In-Stock

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Vyrian

USA . 2,420 parts In-Stock

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Anansix

USA . 272 parts In-Stock

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Andel Nordic

Denmark . 3,185 parts In-Stock

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$4.904

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$4.707

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$4.707

One Stop Electronics

USA . 217 parts In-Stock

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$52.000

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UNI Independent Distributors

Spain . 6,880 parts In-Stock

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Corphita

USA . 3,331 parts In-Stock

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Overview

Elevate your designs with the N74F1245D-T from NXP Semiconductors, a beacon of reliability in bus drivers and transceivers. Crafted with superior quality, this 8-bit solution offers seamless data transmission with minimal propagation delay, making it ideal for high-performance applications. With robust temperature tolerance and compact packaging, you gain flexibility and efficiency, ensuring your projects thrive while enjoying NXP's renowned commitment to innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental factors, making this product reliable for various applications.

Surface Mount: YES

Surface mount capability allows for easier and more efficient PCB assembly, saving space and improving performance.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact design, optimizing space on the circuit board.

No. of Bits: 8

An 8-bit configuration allows for a versatile range of data communication, suitable for a variety of applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard digital circuits, enhancing its utility.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF minimizes signal degradation, ensuring faster and more reliable communication.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options, making this device adaptable for various applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves valuable space on printed circuit boards, making it ideal for compact designs.

Propagation Delay (tpd): 8 ns

A short propagation delay of 8 ns ensures high-speed data communication, making it suitable for high-performance applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is capable of functioning in a wide range of environments.

Output Characteristics: 3-STATE

The 3-state output characteristic allows for efficient bus management, enabling multiple devices to share the same data lines.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures functionality in cooler environments, broadening its application range.

Terminal Position: DUAL

Dual terminal positioning enhances layout flexibility on the PCB, allowing for optimized connections.

No. of Ports: 2

Having 2 ports enables simultaneous connection to multiple devices, enhancing versatility in data communication.

Maximum Seated Height: 2.65 mm

The maximum seated height of 2.65 mm allows for low-profile designs, making it suitable for space-constrained applications.

Width: 7.5 mm

A width of 7.5 mm makes this product compact, facilitating ease of integration into existing designs.

Output Polarity: TRUE

True output polarity ensures compatibility with a wide range of digital systems, enhancing its usability.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V allows for operation in lower voltage environments, making it versatile.

Length: 12.8 mm

A length of 12.8 mm provides a slim profile, promoting space efficiency on the PCB.

Temperature Grade: COMMERCIAL

Being graded for commercial temperature applications means it's suitable for consumer electronics, ensuring reliability.

Technology: TTL

TTL technology ensures compatibility with a variety of digital logic families, widening the potential application scope.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and connection, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers a balance between density and ease of handling during assembly.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows for flexibility in power supply design, accommodating various systems.

Maximum Power Supply Current (ICC): 155 mA

With a maximum power supply current of 155 mA, this chip can deliver ample current for demanding applications.

Technical Specifications

Bus Driver & Transceivers N74F1245D-T attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

DIRECTION CONTROL; IOL = 24MA @ VOL = 0.5V FOR PORT A; IOH = 3MA @ VOH = 2.4V FOR PORT A

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

155 mA

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

N74F1245D-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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