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N74F1243D-T

NXP Semiconductors

N74F1243D-T by NXP Semiconductors

N74F1243D-T by NXP Semiconductors is a 4-bit bus driver with a 7 ns propagation delay, operating b/w 4.5V and 5.5V. It features dual ports and true output polarity, making it ideal for high-speed data transmission in compact electronic designs. Its small outline package ensures efficient space utilization in applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,810 parts In-Stock

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2,810

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Digiode

USA . 368 parts In-Stock

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368

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Anansix

USA . 87 parts In-Stock

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87

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Distributors (Availability)

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Andel Nordic

Denmark . 2,724 parts In-Stock

1+ parts

$8.980

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$8.620

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$8.620

2,724

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$8.620

One Stop Electronics

USA . 1,413 parts In-Stock

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$57.000

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$57.000

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UNI Independent Distributors

Spain . 1,312 parts In-Stock

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Corphita

USA . 617 parts In-Stock

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617

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Overview

Elevate your designs with the N74F1243D-T from NXP Semiconductors, a trusted name in innovation. This versatile 4-bit bus driver and transceiver excels in performance, boasting fast propagation delays and reliable operation across diverse applications. Its compact surface mount design ensures space efficiency, while its robust temperature range delivers consistent reliability. Choose NXP for quality and unlock exceptional value that drives your projects forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures resilience and reliability in various operating conditions.

Surface Mount: YES

Surface mount technology allows for efficient use of space on PCBs, making it suitable for compact designs.

Package Shape: RECTANGULAR

A rectangular package shape optimizes layout and enables easier integration into diverse applications.

No. of Bits: 4

With 4 bits, it supports efficient data transfer, ideal for various digital applications requiring moderate data handling.

Nominal Supply Voltage / Vsup: 5 V

The nominal supply voltage of 5V makes this product compatible with standard logic levels in most digital circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF indicates good performance in high-speed applications while minimizing delay.

No. of Terminals: 14

Having 14 terminals offers flexible connectivity options for various applications without sacrificing performance.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances layout density, making it perfect for space-constrained designs.

Propagation Delay (tpd): 7 ns

A propagation delay of just 7 ns ensures rapid data transmission, enhancing overall circuit performance.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C provides reliable functionality even in warmer environments.

Output Characteristics: 3-STATE

3-state output capability allows the device to be used in bus-oriented systems, increasing versatility.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C ensures functionality in a wide range of environments, suitable for various applications.

Terminal Position: DUAL

The dual terminal position enhances design flexibility for integration into various PCB layouts.

No. of Ports: 2

Two ports facilitate easier connectivity for Dual I/O applications, making it ideal for communication buses.

Maximum Seated Height: 1.75 mm

A low maximum seated height ensures compatibility with low-profile designs, maintaining a sleek form factor.

Width: 3.9 mm

A compact width of 3.9 mm makes it space-efficient, contributing to a smaller overall PCB size.

Output Polarity: TRUE

True output polarity is compatible with standard digital systems, ensuring easy integration into existing designs.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5 V allows for reliable operation in systems where voltage drops may occur.

Length: 8.65 mm

A length of 8.65 mm contributes to its compact nature, fitting well in tight spaces within electronic devices.

Temperature Grade: COMMERCIAL

Commercial temperature grade indicates adaptability for general consumer applications, enhancing its market reach.

Technology: TTL

TTL technology ensures compatibility with a wide range of devices, making it a stable choice for digital circuits.

Terminal Form: GULL WING

Gull wing terminal form accommodates easy soldering and ensures mechanical stability on the PCB.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for standard PCB manufacturing, easing the design process.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V provides headroom for stable operation without the risk of damage.

Maximum Power Supply Current (ICC): 65 mA

A maximum power supply current of 65 mA indicates efficient power management, beneficial for battery-operated devices.

Technical Specifications

Bus Driver & Transceivers N74F1243D-T attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Family:

F/FAST

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

N74F1243D-T Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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