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N74F1244D

NXP Semiconductors

N74F1244D by NXP Semiconductors

N74F1244D by NXP Semiconductors is a TTL bus driver with a 7.5 ns propagation delay and operates at a nominal voltage of 5V. It features 2 functions, supports dual ports, and has a max output current of 64A. Ideal for high-speed data transmission in compact electronic designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,764 parts In-Stock

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Digiode

USA . 3,095 parts In-Stock

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Halfin

Belgium . 1,700 parts In-Stock

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1,700

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Anansix

USA . 1,619 parts In-Stock

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Andel Nordic

Denmark . 3,949 parts In-Stock

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$1.960

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$1.882

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$1.882

3,949

$1.960

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$1.882

One Stop Electronics

USA . 674 parts In-Stock

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$16.000

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674

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Advanced Electronics

New Zealand . 94 parts In-Stock

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$22.021

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$20.039

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$18.057

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94

$22.021

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$18.057

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Corphita

USA . 1,968 parts In-Stock

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Perfect Parts

USA . 698 parts In-Stock

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UNI Independent Distributors

Spain . 184 parts In-Stock

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Overview

Unlock the potential of your designs with the N74F1244D by NXP Semiconductors, a premier choice in bus drivers and transceivers. Renowned for quality and reliability, NXP's cutting-edge technology ensures seamless data transmission with minimal latency. Ideal for high-performance applications, this versatile component enhances efficiency while reducing power consumption—delivering unmatched value to engineers and developers alike. Experience innovation and excellence with every connection!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product reliable for various applications.

Propagation Delay At Nominal Supply: 7.5 ns

With a low propagation delay of just 7.5 ns, this bus driver offers high-speed performance, enhancing overall system efficiency.

Surface Mount: YES

Surface mount technology allows for compact design and ease of integration into smaller circuit boards.

No. of Functions: 2

Having two functions increases versatility, making this product suitable for multiple tasks in one component.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization on PCBs, optimizing design layouts.

No. of Bits: 4

Supporting 4 bits enhances data handling capability, allowing for efficient data transmission.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes this product compatible with standard systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF ensures compatibility with a variety of high-speed applications.

Power Supplies (V): 5

Using a single 5V power supply simplifies design and reduces overall system complexity.

No. of Terminals: 20

With 20 terminals, this device offers ample connectivity options for various configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to a compact form factor, ideal for space-constrained applications.

Maximum I (ol): 64 Amp

The ability to handle up to 64 Amps allows for powerful drives and better overall performance.

Propagation Delay (tpd): 7.5 ns

A consistent propagation delay of 7.5 ns ensures predictable performance in time-sensitive applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this product is suitable for diverse environmental conditions.

Output Characteristics: 3-STATE

3-state output capability allows for efficient bus management, reducing conflicts in data transmission.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures functionality in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish enhances conductivity and corrosion resistance, improving long-term reliability.

Terminal Position: DUAL

Dual terminal positioning provides flexible layout options, facilitating easier routing on the PCB.

No. of Ports: 2

Supporting two ports allows for simultaneous communication pathways, enhancing system design flexibility.

Maximum Seated Height: 2.65 mm

The low seated height of 2.65 mm contributes to space-efficient designs, accommodating tighter component layouts.

Width: 7.5 mm

A compact width of 7.5 mm enables use in tight spaces without compromising functionality.

Output Polarity: TRUE

True output polarity enhances compatibility with other devices in digital systems.

Minimum Supply Voltage (Vsup): 4.5 V

With a minimum supply voltage of 4.5V, this product is highly adaptable to varying power supply configurations.

Length: 12.8 mm

A compact length of 12.8 mm allows this device to fit efficiently within constrained layouts.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures stable performance in standard operating conditions.

Technology: TTL

Utilizing TTL technology provides high-speed operation and simplicity in system integration.

Terminal Form: GULL WING

Gull wing terminal design aids in automated assembly processes, ensuring consistent manufacturing quality.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch offers compatibility with a wide range of PCB designs.

Control Type: ENABLE LOW

ENABLE LOW control type simplifies logic design, ensuring easy integration into existing systems.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides flexibility in application without risking damage.

Maximum Power Supply Current (ICC): 75 mA

A maximum power supply current of 75 mA supports sufficient power for robust performance under load.

Technical Specifications

Bus Driver & Transceivers N74F1244D attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

75 mA

Propagation Delay At Nominal Supply:

7.5 ns

Propagation Delay (tpd):

7.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

N74F1244D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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