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N74F1245D

NXP Semiconductors

N74F1245D by NXP Semiconductors

N74F1245D by NXP Semiconductors is an 8-bit bus driver with a 5V nominal voltage and a propagation delay of just 8 ns. It features dual ports, operates in temperatures from 0 °C to 70 °C, and is ideal for high-speed data transmission applications. Its compact SO package ensures efficient surface mounting.

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5

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1k+

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Vyrian

USA . 2,749 parts In-Stock

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Digiode

USA . 2,405 parts In-Stock

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Resion

USA . 1,468 parts In-Stock

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Halfin

Belgium . 1,100 parts In-Stock

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Anansix

USA . 629 parts In-Stock

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Andel Nordic

Denmark . 3,209 parts In-Stock

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$4.277

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$4.106

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

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$21.298

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$20.437

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One Stop Electronics

USA . 516 parts In-Stock

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$37.000

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UNI Independent Distributors

Spain . 6,573 parts In-Stock

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Corphita

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Overview

Unlock seamless data transfer with the N74F1245D from NXP Semiconductors—a trusted leader in innovative technology. This robust 8-bit bus driver enhances system performance while ensuring reliability in various applications, from consumer electronics to industrial automation. With its compact design and superior thermal management, it optimizes space without compromising quality. Elevate your projects with a component that guarantees efficiency and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to harsh environmental conditions, making it suitable for a wide range of applications.

Surface Mount: YES

The surface mount feature allows for easy integration into modern printed circuit boards (PCBs), saving space and enhancing performance.

Package Shape: RECTANGULAR

The rectangular shape is ideal for compact designs, facilitating efficient use of space in electronic applications.

No. of Bits: 8

An 8-bit architecture supports a wide range of data transmission, making it versatile for various applications.

Nominal Supply Voltage / Vsup: 5V

The nominal supply voltage of 5V aligns with common power requirements, ensuring compatibility with most circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF provides good performance at high speeds, ensuring reliable data transmission.

No. of Terminals: 20

With 20 terminals, this device offers multiple connection options, enhancing flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for a compact design, ideal for space-constrained applications.

Propagation Delay (tpd): 8 ns

A low propagation delay of 8 ns means faster switching times, making it suitable for high-speed applications.

Maximum Operating Temperature: 70 °C

The device can operate at temperatures up to 70 °C, indicating robustness for various environments.

Output Characteristics: 3-STATE

The 3-state output characteristic enhances the flexibility in bus communication by allowing multiple devices to share a common bus.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures functionality in mild climates, broadening application use cases.

Terminal Position: DUAL

Dual terminal positioning provides flexible mounting options, facilitating easier PCB layout.

No. of Ports: 2

Two ports enable communication between multiple devices, effectively facilitating data transfer in parallel applications.

Maximum Seated Height: 2.65 mm

A maximum seated height of 2.65 mm keeps the profile low, making it suitable for compact devices.

Width: 7.5 mm

A compact width of 7.5 mm helps save space on PCBs without sacrificing performance.

Output Polarity: TRUE

True output polarity ensures that logic levels are consistent with standard TTL/CMOS operations.

Minimum Supply Voltage (Vsup): 4.5V

A minimum supply voltage of 4.5V allows operation within a wide range of system voltages.

Length: 12.8 mm

The length of 12.8 mm strikes a good balance between performance and spatial efficiency on PCBs.

Temperature Grade: COMMERCIAL

Being rated for commercial temperatures makes it suitable for consumer electronics and general-purpose applications.

Technology: TTL

Using TTL technology ensures compatibility and reliability in digital logic applications.

Terminal Form: GULL WING

Gull wing terminal form provides easy soldering and enhances connection reliability.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard for many devices, simplifying PCB design and assembly.

Maximum Supply Voltage (Vsup): 5.5V

With a maximum supply voltage of 5.5V, this product is versatile and can safely operate under various conditions.

Maximum Power Supply Current (ICC): 155 mA

A maximum power supply current of 155 mA ensures ample power for demanding applications while maintaining efficiency.

Technical Specifications

Bus Driver & Transceivers N74F1245D attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

DIRECTION CONTROL; IOL = 24MA @ VOL = 0.5V FOR PORT A; IOH = 3MA @ VOH = 2.4V FOR PORT A

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

155 mA

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

N74F1245D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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