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N74F1243D

NXP Semiconductors

N74F1243D by NXP Semiconductors

N74F1243D by NXP Semiconductors is a 4-bit bus driver with a 5V nominal voltage and 7 ns propagation delay. It features dual ports, operates in temperatures from 0 °C to 70 °C, and is ideal for high-speed data transmission applications. Its compact SO package ensures efficient surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,722 parts In-Stock

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1,722

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Anansix

USA . 1,381 parts In-Stock

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1,381

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Digiode

USA . 1,058 parts In-Stock

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1,058

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 1,715 parts In-Stock

1+ parts

$1.935

100+ parts

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1k+ parts

$1.858

10k+ parts

$1.858

1,715

$1.935

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$1.858

$1.858

One Stop Electronics

USA . 1,116 parts In-Stock

1+ parts

$16.000

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1,116

$16.000

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UNI Independent Distributors

Spain . 7,750 parts In-Stock

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7,750

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Corphita

USA . 2,396 parts In-Stock

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Overview

Elevate your designs with the N74F1243D from NXP Semiconductors, a trusted leader in innovation. This versatile 4-bit bus driver and transceiver ensures reliable performance, boasting efficient power management and fast propagation delays for seamless data transfer. Ideal for consumer electronics, automotive, and industrial applications, it simplifies complex connectivity while maximizing efficiency. Choose NXP for quality you can rely on, enhancing both functionality and longevity in your projects!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors.

Surface Mount: YES

Surface mount capability facilitates efficient use of PCB space and improves manufacturing automation.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various circuit layouts and design flexibility.

No. of Bits: 4

With 4 bits, this product supports a wide range of signal processing applications.

Nominal Supply Voltage / Vsup: 5 V

The standard 5V supply voltage aligns with common electronic components, making integration straightforward.

Load Capacitance (CL): 50 pF

Low load capacitance improves speed and efficiency, enhancing overall circuit performance.

No. of Terminals: 14

14 terminals provide ample connection points for versatile configurations and functionalities.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained designs without sacrificing performance.

Propagation Delay (tpd): 7 ns

Fast propagation delay ensures quick response times, making it suitable for high-speed applications.

Maximum Operating Temperature: 70 °C

A 70 °C maximum operating temperature rating ensures reliable performance in moderate thermal conditions.

Output Characteristics: 3-STATE

3-state output capability provides greater flexibility in signal control and multiplexing applications.

Minimum Operating Temperature: 0 °C

Operating down to 0 °C makes it suitable for a variety of applications in less extreme conditions.

Terminal Position: DUAL

Dual terminal positioning enhances mounting stability and connection reliability.

No. of Ports: 2

Two ports enable bidirectional communication, which is essential for various digital signal applications.

Maximum Seated Height: 1.75 mm

Low seated height allows for efficient stacking and enhances the design's overall profile.

Width: 3.9 mm

Compact width enables higher density PCB designs, beneficial in modern electronics.

Output Polarity: TRUE

True output polarity makes signal interpretation straightforward, simplifying design considerations.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate down to 4.5V expands its compatibility with various supply configurations.

Length: 8.65 mm

Compact dimensions facilitate easy integration into tight layouts or where space is at a premium.

Temperature Grade: COMMERCIAL

Commercial temperature grading means it's designed for standard operating conditions, suitable for most consumer applications.

Technology: TTL

TTL technology offers fast switching speeds and reliability, ideal for digital applications.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering reliability and makes assembly easier in surface mount applications.

Terminal Pitch: 1.27 mm

1.27 mm terminal pitch allows for compatibility with a wide range of PCB layouts and components.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V provides flexibility in power supply options without risking damage.

Maximum Power Supply Current (ICC): 65 mA

The 65 mA power supply current rating strikes a good balance between performance and power efficiency for various applications.

Technical Specifications

Bus Driver & Transceivers N74F1243D attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION

Family:

F/FAST

JESD-30 Code:

R-PDSO-G14

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Maximum Power Supply Current (ICC):

65 mA

Propagation Delay (tpd):

7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

N74F1243D Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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