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N74F373D,602

NXP Semiconductors

N74F373D,602 by NXP Semiconductors

NXP Semiconductors' N74F373D,602 is an 8-bit bus driver with a propagation delay of 8ns at 5V. It features a 3-STATE output and operates within a temperature range of 0 to 70°C. Ideal for applications requiring fast signal transmission in commercial-grade environments.

Median Price

$0.498

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

$0.489

1k+ parts

$0.406

10k+ parts

$0.362

2,380

-

$0.489

$0.406

$0.362

Verical

USA . 1,560 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.508

10k+ parts

$0.453

1,560

-

-

$0.508

$0.453

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 846 parts In-Stock

1+ parts

$0.196

100+ parts

-

1k+ parts

-

10k+ parts

-

846

$0.196

-

-

-

Vyrian

USA . 8,294 parts In-Stock

1+ parts

-

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-

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8,294

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-

-

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Anansix

USA . 1,318 parts In-Stock

1+ parts

-

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1,318

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 272 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

272

$0.185

-

-

-

Andel Nordic

Denmark . 2,974 parts In-Stock

1+ parts

$4.687

100+ parts

-

1k+ parts

$4.500

10k+ parts

$4.500

2,974

$4.687

-

$4.500

$4.500

Microchip USA

USA . 208 parts In-Stock

1+ parts

$6.960

100+ parts

$6.960

1k+ parts

$6.960

10k+ parts

$6.960

208

$6.960

$6.960

$6.960

$6.960

AZTECH Wire

Italy . 685 parts In-Stock

1+ parts

$13.180

100+ parts

-

1k+ parts

-

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685

$13.180

-

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Continental Prestige Electronics

USA . 2,380 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.247

10k+ parts

-

2,380

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$0.247

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UNI Independent Distributors

Spain . 1,947 parts In-Stock

1+ parts

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1,947

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Perfect Parts

USA . 15 parts In-Stock

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15

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Overview

Unlock the power of seamless data transmission with the N74F373D,602 from NXP Semiconductors. Crafted with precision and expertise, this bus driver and transceiver category product offers unparalleled reliability and performance. Perfect for a wide range of applications, this small outline package boasts a fast 8ns propagation delay, true output polarity, and 3-STATE output characteristics, making it ideal for high-speed communication systems. Experience the value and benefits of top-notch quality with NXP Semiconductors' N74F373D,602.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components, making the product a reliable choice for long-term use.

Propagation Delay At Nominal Supply: 8 ns

With a low propagation delay, this product offers high-speed data transmission, making it suitable for time-sensitive applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient installation, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and space-saving design, ideal for installations where space is limited.

Nominal Supply Voltage / Vsup (V): 5

Operating at a common supply voltage of 5V makes this product compatible with a wide range of systems and applications.

Output Characteristics: 3-STATE

The 3-state output allows for flexible output control, enabling the product to interface with different devices effectively.

Technology: TTL

Utilizing TTL technology ensures compatibility with other TTL components, enhancing the product's versatility in various circuits.

Technical Specifications

Bus Driver & Transceivers N74F373D,602 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

60 mA

Propagation Delay At Nominal Supply:

8 ns

Propagation Delay (tpd):

8 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

N74F373D,602 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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