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N74F244DB,112

NXP Semiconductors

N74F244DB,112 by NXP Semiconductors

NXP Semiconductors' N74F244DB,112 is a 20-terminal bus driver with 6.5ns propagation delay and 64A output current. Ideal for TTL technology applications requiring fast signal transmission in commercial-grade environments. Features include true output polarity, dual terminal position, and small outline package style.

Median Price

$0.498

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 10,164 parts In-Stock

1+ parts

-

100+ parts

$0.489

1k+ parts

$0.406

10k+ parts

$0.362

10,164

-

$0.489

$0.406

$0.362

Verical

USA . 10,164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.508

10k+ parts

$0.453

10,164

-

-

$0.508

$0.453

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,705 parts In-Stock

1+ parts

$0.196

100+ parts

-

1k+ parts

-

10k+ parts

-

4,705

$0.196

-

-

-

Vyrian

USA . 5,556 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,556

-

-

-

-

Anansix

USA . 186 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

186

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 4,464 parts In-Stock

1+ parts

$0.185

100+ parts

-

1k+ parts

-

10k+ parts

-

4,464

$0.185

-

-

-

Andel Nordic

Denmark . 682 parts In-Stock

1+ parts

$2.054

100+ parts

-

1k+ parts

$1.972

10k+ parts

$1.972

682

$2.054

-

$1.972

$1.972

Microchip USA

USA . 420 parts In-Stock

1+ parts

$8.300

100+ parts

$8.300

1k+ parts

$8.300

10k+ parts

$8.300

420

$8.300

$8.300

$8.300

$8.300

AZTECH Wire

Italy . 1,008 parts In-Stock

1+ parts

$17.650

100+ parts

-

1k+ parts

-

10k+ parts

-

1,008

$17.650

-

-

-

Continental Prestige Electronics

USA . 10,164 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.247

10k+ parts

-

10,164

-

-

$0.247

-

UNI Independent Distributors

Spain . 362 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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362

-

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-

Overview

Elevate your electronic designs with the N74F244DB,112 by NXP Semiconductors. As a trusted manufacturer in the industry, NXP delivers unparalleled quality and reliability in bus driver & transceivers. This versatile component offers fast propagation delay, low power consumption, and 3-state output characteristics, making it ideal for a wide range of applications. Whether you're working on automotive, industrial, or consumer electronics projects, this product provides value, efficiency, and performance that will exceed your expectations. Choose NXP Semiconductors for cutting-edge technology that elevates your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in a variety of environments.

Propagation Delay At Nominal Supply: 6.5 ns

The low propagation delay ensures fast data transmission, making the product suitable for high-speed applications.

Surface Mount: YES

Being surface mountable makes installation easier and provides flexibility in design and placement of the product on a circuit board.

No. of Functions: 2

Having multiple functions in a single component increases efficiency and reduces the need for additional components, saving space and cost.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into circuit board layouts and provides a compact form factor.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard supply voltage of 5V ensures compatibility with a wide range of systems and devices.

Power Supplies (V): 5

Matching power supply voltage further enhances compatibility and reliable performance.

No. of Terminals: 20

Having a sufficient number of terminals allows for versatile connectivity options and functionality.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style saves space on the circuit board and enables dense packing of components.

Maximum I (ol): 64 Amp

The high output current capability allows for driving a variety of loads with ease, making the product versatile and reliable.

Propagation Delay (tpd): 6.5 ns

Low propagation delay ensures quick response time, crucial for real-time applications.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and maintain reliable performance.

Output Characteristics: 3-STATE

3-state output provides added flexibility in controlling the output signal, allowing for more efficient data transmission.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance even in cold environments.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The Ni/Pd/Au terminal finish offers excellent electrical conductivity, corrosion resistance, and solderability, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position enhances connectivity options and allows for flexibility in circuit board layout.

No. of Ports: 2

Having multiple ports enables the product to connect to multiple devices simultaneously, increasing its versatility.

Maximum Seated Height: 2 mm

The low seated height saves space on the circuit board and allows for compact designs.

Width: 5.3 mm

The compact width of the product allows for easy integration into tight spaces and dense circuit board layouts.

Output Polarity: TRUE

True output polarity ensures compatibility with a wide range of systems and devices, enhancing versatility.

Minimum Supply Voltage (Vsup): 4.5 V

Having a low minimum supply voltage allows for operation in low-power environments without compromising performance.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature ensures proper soldering and reliability during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable soldering during assembly processes.

Length: 7.2 mm

The compact length of the product allows for flexibility in circuit board layout and saves space.

Temperature Grade: COMMERCIAL

Commercial-grade temperature specifications ensure reliable performance in typical operating conditions for commercial applications.

Technology: TTL

Utilizing TTL technology provides reliable and fast signal processing, making the product suitable for high-speed applications.

Terminal Form: GULL WING

Gull wing terminal form offers easy soldering and reliable electrical connections, ensuring long-term performance.

Packing Method: TUBE

The tube packing method protects the product during transportation and storage, reducing the risk of damage.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for dense packing of components on the circuit board and saves space.

Control Type: ENABLE LOW

The enable low control type provides flexibility in controlling the operation of the product, enhancing its versatility.

Maximum Supply Voltage (Vsup): 5.5 V

Having a high maximum supply voltage ensures compatibility with a wide range of systems and devices, providing flexibility in use.

Maximum Power Supply Current (ICC): 90 mA

The high maximum power supply current capability allows for driving different loads with ease and ensures reliable performance.

Technical Specifications

Bus Driver & Transceivers N74F244DB,112 attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Control Type:

ENABLE LOW

Family:

F/FAST

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

7.2 mm

Logic IC Type:

Maximum I (ol):

64 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

90 mA

Propagation Delay At Nominal Supply:

6.5 ns

Propagation Delay (tpd):

6.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

TTL

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.3 mm

Trade Compliance

N74F244DB,112 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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