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MRF5S19060NR1

NXP Semiconductors

MRF5S19060NR1 by NXP Semiconductors

NXP Semiconductors' MRF5S19060NR1 is a single N-channel RF Power FET with 65V DS breakdown voltage. Operating in enhancement mode, it offers 218.8W power dissipation and operates in L band applications like amplifiers. The transistor has a max temperature of 200°C and comes in a flatpack package style for surface mount assembly.

Median Price

$40.050

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 972 parts In-Stock

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$40.050

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$39.250

1k+ parts

$38.450

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972

$40.050

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$38.450

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DigiKey

USA . 972 parts In-Stock

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972

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Distributors (In-Stock)

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Digiode

USA . 3,366 parts In-Stock

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$43.140

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3,366

$43.140

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Vyrian

USA . 4,548 parts In-Stock

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$45.410

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Anansix

USA . 2,631 parts In-Stock

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DigiKey Marketplace

USA . 972 parts In-Stock

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972

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Distributors (Availability)

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Corphita

USA . 118 parts In-Stock

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$40.869

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118

$40.869

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Continental Prestige Electronics

USA . 972 parts In-Stock

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$54.480

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972

$54.480

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One Stop Electronics

USA . 646 parts In-Stock

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$84.010

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646

$84.010

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QUARKTWIN TECHNOLOGY LTD

USA . 8,190 parts In-Stock

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UNI Independent Distributors

Spain . 7,541 parts In-Stock

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Microchip USA

USA . 6,027 parts In-Stock

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Overview

Unlock the power of cutting-edge RF technology with the MRF5S19060NR1 by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality RF Power Field Effect Transistors that are perfect for amplifier applications in the L Band. With a single configuration and maximum power dissipation of 218.8 W, this transistor offers unbeatable value and performance. Trust NXP Semiconductors to provide reliable, high-quality solutions for all your RF needs. Elevate your projects with the MRF5S19060NR1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides good thermal and mechanical properties, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower resistance and better performance compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE

The single configuration simplifies the design and integration of the FET into the circuit, making it easier to work with.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, ensuring optimal performance and efficiency in amplifying signals.

Surface Mount: YES

Surface mount capability allows for easy and efficient PCB assembly, saving time and space in the overall design.

Minimum DS Breakdown Voltage: 65 V

Provides a high breakdown voltage, ensuring reliable operation and protection against excess voltage.

Highest Frequency Band: L BAND

Designed for use in the L band frequency range, making it suitable for a wide range of communication and radar applications.

Maximum Power Dissipation (Abs): 218.8 W

High power dissipation capability allows the FET to handle large power levels without overheating or malfunctioning.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature, the FET can operate reliably in a variety of environmental conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and efficiency, making the FET a reliable choice for various applications.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF5S19060NR1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JEDEC-95 Code:

TO-270

JESD-30 Code:

R-PDFP-F4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF5S19060NR1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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