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MRF5S19060NBR1

NXP Semiconductors

MRF5S19060NBR1 by NXP Semiconductors

NXP's MRF5S19060NBR1 is a single N-channel RF FET with 65V DS breakdown voltage, ideal for amplifier applications in L Band. It features 218.8W max power dissipation, operates in enhancement mode, and has a max temp of 200°C.

Median Price

$43.400

Lifecycle Status

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6

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1k+

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Rochester

USA . 332 parts In-Stock

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$43.400

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$38.830

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$36.540

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DigiKey

USA . 332 parts In-Stock

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Digiode

USA . 532 parts In-Stock

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$45.914

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Vyrian

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Anansix

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Speed Components Ltd

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One Stop Electronics

USA . 116 parts In-Stock

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$41.080

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Corphita

USA . 4,906 parts In-Stock

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$43.497

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Continental Prestige Electronics

USA . 332 parts In-Stock

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$58.000

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Microchip USA

USA . 294 parts In-Stock

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$106.697

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Authorized Procurement Solutions

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UNI Independent Distributors

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Overview

Unlock the power of cutting-edge technology with the MRF5S19060NBR1 RF Power Field Effect Transistor by NXP Semiconductors. This high-quality transistor offers unparalleled performance and reliability, making it ideal for a wide range of applications such as amplifiers. With its N-CHANNEL polarity and SINGLE configuration, this transistor is designed to enhance your projects with ease. Experience the value and benefits that only NXP Semiconductors can provide, and take your designs to the next level with the MRF5S19060NBR1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower ON-state resistance and faster switching speeds compared to P-channel transistors, making them suitable for high-performance applications.

Configuration: SINGLE

The single configuration simplifies the circuit design and makes installation easier, making it ideal for applications that require a straightforward setup.

Transistor Application: AMPLIFIER

Designed specifically for amplifier applications, this transistor provides high power amplification capabilities, making it suitable for use in signal processing and communication systems.

Surface Mount: YES

Being surface mountable allows for easy integration onto circuit boards, saving space and simplifying the manufacturing process.

Minimum DS Breakdown Voltage: 65 V

With a minimum breakdown voltage of 65V, this transistor can handle higher voltages, making it suitable for applications requiring higher power handling capabilities.

Operatin Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally off devices, which means they have lower power consumption and can be easily controlled by a gate signal, making them efficient for various applications.

Highest Frequency Band: L BAND

Capable of operating in the L band frequency range, this transistor is suitable for applications in radar systems, satellite communication, and other high-frequency applications.

Maximum Power Dissipation (Abs): 218.8 W

With a high maximum power dissipation, this transistor can handle large power loads without overheating, ensuring reliable performance in high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy installation and heat dissipation, making it suitable for applications where heat management is critical.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high reliability and low leakage current, making this transistor ideal for high-performance applications requiring long-term stability.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature, this transistor can withstand elevated temperatures, making it suitable for use in environments where heat dissipation is a concern.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making them suitable for various applications requiring precision and consistency in operation.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and longevity of the transistor.

Moisture Sensitivity Level (MSL): 3

A moisture sensitivity level of 3 indicates that this transistor is sensitive to moisture exposure, so proper handling and storage procedures should be followed to maintain its performance and reliability.

Case Connection: SOURCE

The source terminal connection allows for easy integration into circuit designs and efficient signal processing, making this transistor suitable for applications requiring high current handling capabilities.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF5S19060NBR1 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

L BAND

JEDEC-95 Code:

TO-272

JESD-30 Code:

R-PDFM-F4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF5S19060NBR1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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