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MRF5P21240HR6

NXP Semiconductors

MRF5P21240HR6 by NXP Semiconductors

The NXP Semiconductors MRF5P21240HR6 is an RF Power FET with 65V DS breakdown voltage, 603W power dissipation, and S Band frequency band. Commonly used in amplifiers, it features a ceramic-metal-sealed package body and operates in enhancement mode. Ideal for applications requiring high-power RF amplification in the S Band range.

Median Price

$156.160

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9 parts In-Stock

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$156.160

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$146.790

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$132.740

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DigiKey

USA . 9 parts In-Stock

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Digiode

USA . 4,543 parts In-Stock

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$148.352

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Vyrian

USA . 5,965 parts In-Stock

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Anansix

USA . 1,919 parts In-Stock

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DigiKey Marketplace

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One Stop Electronics

USA . 9 parts In-Stock

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$132.740

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Corphita

USA . 4,474 parts In-Stock

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$140.544

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Continental Prestige Electronics

USA . 9 parts In-Stock

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$187.400

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Microchip USA

USA . 6,722 parts In-Stock

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$224.865

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UNI Independent Distributors

Spain . 1,837 parts In-Stock

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Overview

Unleash the power of innovation with the MRF5P21240HR6 by NXP Semiconductors. This RF Power Field Effect Transistor (FET) is a game-changer in amplifier applications, offering unparalleled performance and reliability. With a focus on quality and cutting-edge technology, NXP Semiconductors ensures that this transistor exceeds industry standards. Whether you're working in the S Band frequency range or require high power dissipation capabilities, this product delivers. Embrace the future of electronics with the MRF5P21240HR6 and experience the benefits of top-tier performance and efficiency in your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed co-fired package provides durability and reliability, making this product suitable for harsh environments.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower resistance and higher efficiency compared to P-channel FETs, making them a good choice for power applications.

Configuration: COMMON SOURCE, 2 ELEMENTS

Common source configuration with 2 elements allows for simplified circuit design and efficient power amplification.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance in amplifying signals.

Surface Mount: YES

Surface mount capability allows for easy and space-saving integration onto PCBs, making it convenient for modern electronics manufacturing.

Maximum Power Dissipation (Abs): 603 W

High power dissipation capability of 603W ensures reliable operation even under high power conditions.

Maximum Operating Temperature: 200 °C

With a maximum operating temperature of 200°C, this FET can withstand high temperature environments without degrading performance.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF5P21240HR6 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-CDFM-F4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF5P21240HR6 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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