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MPC885ZP133

NXP Semiconductors

MPC885ZP133 by NXP Semiconductors

MICROPROCESSOR, RISC; Terminal Form: BALL; No. of Terminals: 357; Package Code: BGA; Package Shape: SQUARE; Minimum Supply Voltage: 1.7 V;

Median Price

$39.620

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

MPC885ZP133 by NXP Semiconductors
Compare Share

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 379 parts In-Stock

1+ parts

$37.590

100+ parts

-

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379

$37.590

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Flip Electronics (Authorized)

USA . 7,614 parts In-Stock

1+ parts

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7,614

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Farnell

UK . 60 parts In-Stock

1+ parts

-

100+ parts

$53.820

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10k+ parts

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60

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$53.820

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Rochester

USA . 36 parts In-Stock

1+ parts

-

100+ parts

$39.620

1k+ parts

$35.450

10k+ parts

$33.370

36

-

$39.620

$35.450

$33.370

DigiKey

USA . 6 parts In-Stock

1+ parts

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6

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Distributors (In-Stock)

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Vyrian

USA . 93 parts In-Stock

1+ parts

$24.160

100+ parts

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93

$24.160

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Digiode

USA . 3,526 parts In-Stock

1+ parts

$35.710

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3,526

$35.710

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Flip Electronics

USA . 8,061 parts In-Stock

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8,061

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Anansix

USA . 2,129 parts In-Stock

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2,129

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Legend Electronics Inc.

USA . 1,272 parts In-Stock

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1,272

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Chip Stock

USA . 379 parts In-Stock

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379

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Component Sense

UK . 131 parts In-Stock

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131

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DigiKey Marketplace

USA . 36 parts In-Stock

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36

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ComSIT Distribution GmbH

Germany . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,245 parts In-Stock

1+ parts

$33.831

100+ parts

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1,245

$33.831

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Vigor

Singapore . 846 parts In-Stock

1+ parts

$42.370

100+ parts

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846

$42.370

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Component Stockers USA

USA . 497 parts In-Stock

1+ parts

$45.280

100+ parts

$63.650

1k+ parts

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10k+ parts

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497

$45.280

$63.650

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Microchip USA

USA . 1,832 parts In-Stock

1+ parts

$97.451

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1,832

$97.451

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UNI Independent Distributors

Spain . 7,714 parts In-Stock

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7,714

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A-Z Elektronik GmbH

Germany . 5,993 parts In-Stock

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5,993

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GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Speed Components Ltd (Excess)

Israel . 34 parts In-Stock

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34

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Authorized Procurement Solutions

USA . 19 parts In-Stock

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19

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Legend Electronics Inc. (Excess)

USA . 19 parts In-Stock

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19

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Technical Specifications

Microprocessors MPC885ZP133 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Address Bus Width:

32

Bit Size:

32

Boundary Scan:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B357

JESD-609 Code:

e0

Length:

25 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

357

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA357,19X19,50

Package Shape:

Package Style (Meter):

GRID ARRAY

Peak Reflow Temperature (C):

245

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

Maximum Seated Height:

2.52 mm

Speed:

133 rpm

Sub-Category:

Microprocessors

Maximum Supply Voltage:

1.9 V

Minimum Supply Voltage:

1.7 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

25 mm

Peripheral IC Type:

Trade Compliance

MPC885ZP133 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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