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MKW31Z256VHT4

NXP Semiconductors

MKW31Z256VHT4 by NXP Semiconductors

MICROPROCESSOR CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: QCCN; Package Shape: SQUARE;

Median Price

$4.494

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,300 parts In-Stock

1+ parts

$2.974

100+ parts

-

1k+ parts

-

10k+ parts

-

1,300

$2.974

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Chip1Stop

Japan . 1,300 parts In-Stock

1+ parts

$4.740

100+ parts

-

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-

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1,300

$4.740

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Mouser Electronics

USA . 1,300 parts In-Stock

1+ parts

$5.770

100+ parts

$4.130

1k+ parts

$3.890

10k+ parts

-

1,300

$5.770

$4.130

$3.890

-

DigiKey

USA . 800 parts In-Stock

1+ parts

$7.350

100+ parts

$4.782

1k+ parts

$4.421

10k+ parts

$4.313

800

$7.350

$4.782

$4.421

$4.313

Verical

USA . 9,100 parts In-Stock

1+ parts

-

100+ parts

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$4.249

9,100

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$4.249

Rochester

USA . 260 parts In-Stock

1+ parts

-

100+ parts

$3.710

1k+ parts

$3.320

10k+ parts

$3.130

260

-

$3.710

$3.320

$3.130

Flip Electronics (Authorized)

USA . 255 parts In-Stock

1+ parts

-

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255

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 483 parts In-Stock

1+ parts

$3.538

100+ parts

-

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483

$3.538

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Vyrian

USA . 4,365 parts In-Stock

1+ parts

$3.724

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4,365

$3.724

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J2 Sourcing AB

Sweden . 40,095 parts In-Stock

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40,095

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Anansix

USA . 2,600 parts In-Stock

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2,600

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TME

Poland . 520 parts In-Stock

1+ parts

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$5.370

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520

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$5.370

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Flip Electronics

USA . 255 parts In-Stock

1+ parts

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100+ parts

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255

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 879 parts In-Stock

1+ parts

$3.070

100+ parts

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879

$3.070

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Corphita

USA . 2,457 parts In-Stock

1+ parts

$3.352

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2,457

$3.352

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Corohmni

South Africa . 612 parts In-Stock

1+ parts

$4.170

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612

$4.170

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Perfect Parts

USA . 6,698 parts In-Stock

1+ parts

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6,698

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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6,000

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UNI Independent Distributors

Spain . 1,234 parts In-Stock

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1,234

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Technical Specifications

Other Function uPs,uCs & Peripheral ICs MKW31Z256VHT4 attributes and parameters. Explore more Other Function uPs,uCs & Peripheral ICs devices from NXP Semiconductors

Specs

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

48

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL GOLD

Terminal Form:

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Peripheral IC Type:

Trade Compliance

MKW31Z256VHT4 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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