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MCF5274LVM166

NXP Semiconductors

MCF5274LVM166 by NXP Semiconductors

MICROPROCESSOR, RISC; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

Median Price

$47.513

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

1+ parts

$56.420

100+ parts

$41.170

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2

$56.420

$41.170

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Flip Electronics (Authorized)

USA . 629 parts In-Stock

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629

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EBV Elektronik

Germany . 504 parts In-Stock

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Verical

USA . 407 parts In-Stock

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$47.513

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$42.513

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$40.013

407

-

$47.513

$42.513

$40.013

Rochester

USA . 407 parts In-Stock

1+ parts

-

100+ parts

$38.010

1k+ parts

$34.010

10k+ parts

$32.010

407

-

$38.010

$34.010

$32.010

Distributors (In-Stock)

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Digiode

USA . 620 parts In-Stock

1+ parts

$20.729

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620

$20.729

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Vyrian

USA . 1,970 parts In-Stock

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$21.813

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Anansix

USA . 2,070 parts In-Stock

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Flip Electronics

USA . 629 parts In-Stock

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629

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Chip Stock

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625

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SPM Sales

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500

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Prism Electronics

USA . 16 parts In-Stock

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Bristol Electronics

USA . 5 parts In-Stock

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Atlantic Semiconductor

USA . 5 parts In-Stock

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Distributors (Availability)

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Benley Electronics

USA . 4 parts In-Stock

1+ parts

$7.500

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$7.500

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Corphita

USA . 896 parts In-Stock

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$19.638

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$19.638

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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A-Z Elektronik GmbH

Germany . 4,938 parts In-Stock

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4,938

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UNI Independent Distributors

Spain . 4,630 parts In-Stock

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4,630

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Microchip USA

USA . 4,557 parts In-Stock

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4,557

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Glotronic Ltd.

UK . 1,800 parts In-Stock

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Perfect Parts

USA . 1,284 parts In-Stock

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1,284

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Technical Specifications

Microprocessors MCF5274LVM166 attributes and parameters. Explore more Microprocessors devices from NXP Semiconductors

Specs

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

Maximum Clock Frequency:

83 MHz

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B196

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

196

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Speed:

166 rpm

Maximum Supply Voltage:

1.6 V

Minimum Supply Voltage:

1.4 V

Nominal Supply Voltage:

1.5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

40

Width:

15 mm

Peripheral IC Type:

Trade Compliance

MCF5274LVM166 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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