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MC33HB2001FKR2

NXP Semiconductors

MC33HB2001FKR2 by NXP Semiconductors

MC33HB2001FKR2 by NXP Semiconductors is a Motion Control IC with 32 terminals, operating voltage range of 5-28V, and max output current of 16A. Ideal for automotive applications due to AEC-Q100 screening, MOS technology, and temp range -40 to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 6,172 parts In-Stock

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Digiode

USA . 2,827 parts In-Stock

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Anansix

USA . 1,049 parts In-Stock

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Nova Conductors

Japan . 72 parts In-Stock

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Aztec Data Supply Inc.

USA . 143 parts In-Stock

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$4.600

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One Stop Electronics

USA . 1,635 parts In-Stock

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$6.500

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Ampacity Inc.

Singapore . 916 parts In-Stock

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Corohmni

South Africa . 289 parts In-Stock

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$6.894

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AZTECH Wire

Italy . 678 parts In-Stock

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$19.404

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Microchip USA

USA . 3,084 parts In-Stock

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$30.190

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Argo Parts USA

USA . 3,508 parts In-Stock

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UNI Independent Distributors

Spain . 2,818 parts In-Stock

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Corphita

USA . 1,851 parts In-Stock

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Continental Prestige Electronics

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Bastille Electronics

Australia . 100 parts In-Stock

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Overview

Unleash the power of precise motion control with the MC33HB2001FKR2 from NXP Semiconductors. Designed with cutting-edge technology and automotive-grade quality, this Brush DC Motor Controller offers unparalleled performance in a compact chip carrier package. Whether you're looking to optimize your automotive systems or enhance your industrial applications, this motion control IC delivers reliable operation and efficient power management. Experience seamless integration, high output current capabilities, and a wide operating temperature range to meet all your project needs. Elevate your designs with the MC33HB2001FKR2 and unlock a new level of precision and control.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the IC, making it suitable for various industrial applications.

Surface Mount: YES

Allows for easy installation on PCBs, saving assembly time and space.

Screening Level: AEC-Q100

Ensures high reliability and quality performance, ideal for automotive applications where ruggedness is required.

Nominal Supply Voltage (Vsup): 12 V

Optimal voltage for efficient operation and compatibility with a wide range of power sources.

No. of Terminals: 32

Provides versatility in connecting to other components and peripherals in the system.

Maximum Operating Temperature: 125 °C

Allows the IC to function effectively in high-temperature environments without overheating.

Minimum Operating Temperature: -40 °C

Ensures the IC can operate reliably in cold conditions, making it suitable for various environments.

Maximum Output Current: 16 A

Capable of handling high current loads, making it suitable for driving powerful DC motors.

Technical Specifications

Motion Control ICs MC33HB2001FKR2 attributes and parameters. Explore more Motion Control ICs devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

S-PQCC-N32

Length:

8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

16 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

2.2 mm

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

5 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

8 mm

Trade Compliance

MC33HB2001FKR2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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