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IRAMS10UP60B-2

Infineon Technologies

IRAMS10UP60B-2 by Infineon Technologies

IRAMS10UP60B-2 by Infineon Technologies is a Motion Control IC with 1 function. It operates at a nominal voltage of 15V and has a max output current of 15A. This AC motor controller is commonly used in automotive applications.

Median Price

$14.145

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$14.145

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10

$14.145

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Vyrian

USA . 8,287 parts In-Stock

1+ parts

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8,287

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Digiode

USA . 355 parts In-Stock

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355

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Cogito LLC

Ukraine . 16 parts In-Stock

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16

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 3,893 parts In-Stock

1+ parts

$1.285

100+ parts

$1.234

1k+ parts

$1.182

10k+ parts

-

3,893

$1.285

$1.234

$1.182

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Semicontronic

India . 1,241 parts In-Stock

1+ parts

$2.500

100+ parts

$2.438

1k+ parts

$2.425

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-

1,241

$2.500

$2.438

$2.425

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Aztec Data Supply Inc.

USA . 3,183 parts In-Stock

1+ parts

$3.323

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3,183

$3.323

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AZTECH Wire

Italy . 607 parts In-Stock

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$5.887

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607

$5.887

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Ampacity Inc.

Singapore . 1,392 parts In-Stock

1+ parts

$6.500

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1,392

$6.500

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Continental Prestige Electronics

USA . 6,840 parts In-Stock

1+ parts

$14.145

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$13.862

6,840

$14.145

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$13.862

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$14.145

100+ parts

$13.862

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2,000

$14.145

$13.862

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Corohmni

South Africa . 1,228 parts In-Stock

1+ parts

$21.380

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$21.380

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Argo Parts USA

USA . 3,401 parts In-Stock

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Glotronic Ltd.

UK . 1,920 parts In-Stock

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1,920

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Microchip USA

USA . 197 parts In-Stock

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197

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Assy Fe

Spain . 26 parts In-Stock

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Corphita

USA . 5 parts In-Stock

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5

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Overview

Experience superior motion control with the IRAMS10UP60B-2 by Infineon Technologies. As a leader in the industry, Infineon Technologies delivers top-quality products that are trusted by professionals worldwide. The IRAMS10UP60B-2 is a versatile motion control IC that offers exceptional performance and reliability. Whether you're looking to enhance your automotive applications or optimize industrial automation, this product is designed to meet your needs. With its advanced technology and wide range of functions, the IRAMS10UP60B-2 provides customers with unparalleled value, benefits, and advantages. Upgrade your motion control systems today and experience the difference with Infineon Technologies.

Feature Benefit Bullets

No. of Functions: 1

Having only one function ensures simplicity and ease of use.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and compact designs.

Nominal Supply Voltage (Vsup): 15 V

The 15V supply voltage provides a stable and reliable power source for the motion control IC.

Power Supplies (V): 15

With 15 power supplies available, the IC can handle a variety of input voltage levels.

No. of Terminals: 25

The large number of terminals allows for versatile connectivity and compatibility with other components.

Package Style (Meter): FLANGE MOUNT

The flange mount package style ensures secure and stable mounting for the IC, minimizing the risk of damage.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this IC can withstand demanding and harsh environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for reliable operation even in extremely cold conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides excellent conductivity and solderability, ensuring optimal performance.

Terminal Position: ZIG-ZAG

The zig-zag terminal position facilitates easy and efficient PCB routing, simplifying the overall design process.

Other IC type: AC MOTOR CONTROLLER

This motion control IC specifically caters to AC motor control applications, making it an ideal choice for such use cases.

Minimum Supply Voltage (Vsup): 12 V

With a low minimum supply voltage, this IC can operate efficiently even in low-power scenarios.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this IC meets the stringent requirements and reliability standards of the automotive industry.

Maximum Supply Current (Isup): 3.3 mA

With a low maximum supply current, this IC ensures energy-efficient operation.

Maximum Output Current: 15 A

The high maximum output current allows for powerful and reliable motion control capabilities.

Technology: HYBRID

The hybrid technology employed in this IC combines the best features of different technologies, resulting in enhanced performance and functionality.

Terminal Form: THROUGH-HOLE

The through-hole terminal form ensures secure and robust connections, suitable for applications requiring mechanical strength.

Terminal Pitch: 1.98 mm

With a small terminal pitch, this IC allows for high-density mounting and saves valuable board space.

Maximum Supply Voltage (Vsup): 20 V

The 20V maximum supply voltage provides flexibility and compatibility with a wide range of power sources.

Technical Specifications

Motion Control ICs IRAMS10UP60B-2 attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-XZFM-T25

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

25

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

15 A

Package Body Material:

UNSPECIFIED

Package Code:

ZIP

Package Equivalence Code:

ZIP19/23H,.2,.1,78FL

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Power Supplies (V):

15

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

3.3 mA

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

12 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

1.98 mm

Terminal Position:

ZIG-ZAG

Trade Compliance

IRAMS10UP60B-2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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