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IRAM136-3023B2

Infineon Technologies

IRAM136-3023B2 by Infineon Technologies

Infineon's IRAM136-3023B2 is a Motion Control IC with 18 terminals, operating voltage range of 12V to 20V. It features HYBRID technology, supports AC motor control applications, and operates b/w -20°C to 100°C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 5,232 parts In-Stock

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Digiode

USA . 542 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Corohmni

South Africa . 188 parts In-Stock

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$1.018

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Ampacity Inc.

Singapore . 1,139 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 702 parts In-Stock

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$8.726

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Aztec Data Supply Inc.

USA . 232 parts In-Stock

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Modulus Dynamics

Lithuania . 4,361 parts In-Stock

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$17.723

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$17.014

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$16.305

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Microchip USA

USA . 4,329 parts In-Stock

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Continental Prestige Electronics

USA . 2,023 parts In-Stock

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Corphita

USA . 961 parts In-Stock

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Argo Parts USA

USA . 637 parts In-Stock

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Bastille Electronics

Australia . 500 parts In-Stock

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Overview

Elevate your motion control applications with the IRAM136-3023B2 by Infineon Technologies. With a reputation for high-quality manufacturing, this AC motor controller offers unparalleled value and benefits. Its hybrid technology ensures optimal performance in a wide range of temperatures, from -20°C to 100°C. Whether you're looking to enhance industrial automation or robotics, this IC's flange mount package and single terminal position make it easy to integrate seamlessly into your designs. Trust Infineon Technologies to deliver innovative solutions that drive efficiency and productivity in your projects.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape provides a compact and efficient design for easy mounting and integration in various systems.

Nominal Supply Voltage (Vsup): 15 V

Suitable supply voltage for optimal performance and efficiency of the motion control IC.

No. of Terminals: 18

Sufficient number of terminals for connecting and controlling various components in a system.

Package Style (Meter): FLANGE MOUNT

Flange mount package style allows for secure attachment to external components or machinery.

Maximum Operating Temperature: 100 °C

High maximum operating temperature ensures reliability and stability in demanding environments.

Minimum Operating Temperature: -20 °C

Wide range of minimum operating temperature allows for usage in extreme cold conditions.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection process.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, making it a specialized and efficient choice for motor control applications.

Minimum Supply Voltage (Vsup): 12 V

Low minimum supply voltage allows for flexibility in power source options for the motion control IC.

Technology: HYBRID

Hybrid technology combines the advantages of different technologies for improved performance and functionality.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides durability and reliability for secure electrical connections.

Maximum Supply Voltage (Vsup): 20 V

High maximum supply voltage capability allows for versatility in different power supply configurations.

Technical Specifications

Motion Control ICs IRAM136-3023B2 attributes and parameters. Explore more Motion Control ICs devices from Infineon Technologies

Specs

Other IC type:

JESD-30 Code:

R-XSFM-T18

No. of Functions:

1

No. of Terminals:

18

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Maximum Supply Voltage (Vsup):

20 V

Minimum Supply Voltage (Vsup):

12 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Technology:

HYBRID

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Trade Compliance

IRAM136-3023B2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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