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LPC43S70FET100E

NXP Semiconductors

LPC43S70FET100E by NXP Semiconductors

NXP Semiconductors' LPC43S70FET100E is a 32-bit microcontroller with 3.6V max supply voltage, 25MHz clock frequency, and 49 I/O lines. Ideal for applications requiring ADC and PWM channels, it features a RISC architecture and thin profile grid array package style.

Median Price

$8.089

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 115 parts In-Stock

1+ parts

$13.100

100+ parts

$8.430

1k+ parts

$7.790

10k+ parts

-

115

$13.100

$8.430

$7.790

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Verical

USA . 9,880 parts In-Stock

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$8.089

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$8.089

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Flip Electronics (Authorized)

USA . 227 parts In-Stock

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227

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Rochester

USA . 20 parts In-Stock

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100+ parts

$7.790

1k+ parts

$6.970

10k+ parts

$6.560

20

-

$7.790

$6.970

$6.560

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,531 parts In-Stock

1+ parts

$7.467

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2,531

$7.467

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Vyrian

USA . 6,963 parts In-Stock

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6,963

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Flip Electronics

USA . 2,080 parts In-Stock

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2,080

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Anansix

USA . 1,148 parts In-Stock

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Semi Source

USA . 190 parts In-Stock

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190

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Distributors (Availability)

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Corphita

USA . 155 parts In-Stock

1+ parts

$7.074

100+ parts

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155

$7.074

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Vigor

Singapore . 206 parts In-Stock

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$13.420

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206

$13.420

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Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$30.474

100+ parts

$27.731

1k+ parts

$24.989

10k+ parts

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15

$30.474

$27.731

$24.989

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Microchip USA

USA . 1,167 parts In-Stock

1+ parts

$40.210

100+ parts

$39.630

1k+ parts

$39.350

10k+ parts

$39.060

1,167

$40.210

$39.630

$39.350

$39.060

UNI Independent Distributors

Spain . 2,166 parts In-Stock

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Overview

Unleash the power of innovation with the LPC43S70FET100E by NXP Semiconductors. This top-of-the-line microcontroller offers unmatched quality and reliability, making it the go-to choice for a wide range of applications. With its advanced features and cutting-edge technology, this product provides exceptional value, benefits, and advantages to customers looking to take their projects to the next level. Experience seamless performance and enhanced functionality with the LPC43S70FET100E - the perfect solution for all your microcontroller needs.

Feature Benefit Bullets

Surface Mount: YES

Surface mount technology allows for high-density placement on PCB, saving space and reducing overall product size.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs, making it versatile for different power supply requirements.

Address Bus Width: 14

Wide address bus width allows for efficient memory access and data processing.

Package Shape: SQUARE

Square package shape provides stability and ease of mounting on PCB.

Bit Size: 32

32-bit processing capability offers high performance and efficient data handling.

No. of Terminals: 100

Ample number of terminals for connectivity and interfacing with external devices.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch enables high-density mounting and connectivity.

Minimum Supply Voltage: 2.2 V

Low minimum supply voltage ensures energy efficiency and compatibility with low-power applications.

Terminal Finish: TIN SILVER COPPER

Tin, silver, copper terminal finish provides good conductivity and corrosion resistance for reliable performance.

ADC Channels: YES

Built-in analog-to-digital converter channels simplify analog signal processing and conversion.

DMA Channels: YES

Direct memory access channels enhance data transfer speed and efficiency.

Terminal Position: BOTTOM

Bottom terminal position allows for easy PCB layout and design.

Width: 9 mm

Compact width dimension for space-constrained applications.

External Data Bus Width: 8

Efficient 8-bit external data bus width for data transfer and communication.

Maximum Clock Frequency: 25 MHz

High maximum clock frequency for fast data processing and real-time performance.

Maximum Time At Peak Reflow Temperature (s): 30

30-second maximum time at peak reflow temperature ensures proper soldering and assembly process.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability for reliable solder joints and durability.

Length: 9 mm

Compact length dimension for space-saving design and integration.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture for efficient and high-speed processing of instructions.

Terminal Form: BALL

Ball terminal form for secure attachment and soldering on PCB.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage for consistent and reliable operation.

PWM Channels: YES

Pulse-width modulation channels for precise control and modulation of output signals.

Terminal Pitch: 0.8 mm

Fine terminal pitch for high-density mounting and connection flexibility.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates suitable handling and storage requirements for the product.

Speed: 204 rpm

High speed capability for fast data processing and computation.

No. of I/O Lines: 49

Sufficient number of I/O lines for interfacing with external peripherals and devices.

Technical Specifications

Microcontrollers LPC43S70FET100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

14

Bit Size:

32

Maximum Clock Frequency:

25 MHz

DMA Channels:

YES

External Data Bus Width:

8

JESD-609 Code:

e1

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

49

No. of Terminals:

100

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Speed:

204 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Peripheral IC Type:

Trade Compliance

LPC43S70FET100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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