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LPC4353JET256,551

NXP Semiconductors

LPC4353JET256,551 by NXP Semiconductors

LPC4353JET256,551 by NXP Semiconductors is a 32-bit microcontroller with a max supply voltage of 3.6V and a temperature range of -40 to 85°C. It features 164 I/O lines and is suitable for industrial applications requiring high-speed processing and ADC/DAC functionality.

Median Price

$11.785

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 540 parts In-Stock

1+ parts

$10.320

100+ parts

$10.110

1k+ parts

$9.910

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540

$10.320

$10.110

$9.910

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Verical

USA . 9,990 parts In-Stock

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$13.250

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9,990

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$13.250

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Distributors (In-Stock)

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Digiode

USA . 189 parts In-Stock

1+ parts

$9.804

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189

$9.804

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Nova Conductors

Japan . 300 parts In-Stock

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$16.577

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$16.577

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Vyrian

USA . 5,176 parts In-Stock

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5,176

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Anansix

USA . 1,842 parts In-Stock

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1,842

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Distributors (Availability)

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AZTECH Wire

Italy . 539 parts In-Stock

1+ parts

$7.848

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539

$7.848

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Semicontronic

India . 333 parts In-Stock

1+ parts

$8.770

100+ parts

$8.551

1k+ parts

$8.507

10k+ parts

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333

$8.770

$8.551

$8.507

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Corphita

USA . 2,488 parts In-Stock

1+ parts

$9.288

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2,488

$9.288

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Netroflash

USA . 1,000 parts In-Stock

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$16.577

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1,000

$16.577

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Corohmni

South Africa . 1,468 parts In-Stock

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$16.758

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$16.758

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$16.909

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$16.909

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$16.909

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5,000

$16.909

$16.909

$16.909

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Ampacity Inc.

Singapore . 512 parts In-Stock

1+ parts

$19.090

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512

$19.090

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Aztec Data Supply Inc.

USA . 4,872 parts In-Stock

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$22.220

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4,872

$22.220

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Microchip USA

USA . 4,465 parts In-Stock

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$23.462

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Argo Parts USA

USA . 1,345 parts In-Stock

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1,345

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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UNI Independent Distributors

Spain . 367 parts In-Stock

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367

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Overview

Discover the LPC4353JET256,551 microcontroller by NXP Semiconductors, a game-changer in the world of technology. With its high-quality manufacturing and cutting-edge features, this microcontroller stands out from the competition. Designed for a wide range of applications, it offers unparalleled performance and reliability. Experience the value it brings to your projects with its advanced capabilities, including DAC and ADC channels, DMA support, and PWM functionality. Its compact size and low profile make it easy to integrate into any design. Trust NXP Semiconductors to deliver innovative solutions that exceed your expectations. Upgrade your projects with the LPC4353JET256,551 and unlock endless possibilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the microcontroller, making it a reliable choice for various applications.

Surface Mount: YES

Being surface mountable allows for easy integration and space-saving in electronic designs, making this microcontroller a convenient option for compact systems.

Maximum Supply Voltage: 3.6 V

With a high maximum supply voltage, this microcontroller can handle a wide range of power inputs, providing flexibility and compatibility with different power sources.

Address Bus Width: 24

A 24-bit address bus width allows for a larger memory address space, enabling the microcontroller to access more data and execute complex operations efficiently.

Package Shape: SQUARE

The square package shape simplifies mounting and placement, increasing ease of assembly and making it suitable for designs with limited space.

Bit Size: 32

Operating with a 32-bit architecture, this microcontroller offers enhanced processing capabilities, enabling faster execution of instructions and better performance overall.

DAC Channels: YES

The presence of DAC channels allows for analog output generation, making this microcontroller an excellent choice for applications requiring precise analog control or signal generation.

Power Supplies (V): 2.5/3.3

Supporting multiple power supply voltages, this microcontroller offers flexibility in connecting to different power sources, accommodating a variety of system requirements.

No. of Terminals: 256

With 256 terminals, this microcontroller provides sufficient connectivity options for interfacing with other components, devices, and peripherals, facilitating versatile system integration.

Package Style (Meter): GRID ARRAY, LOW PROFILE

The grid array, low profile package style enhances electrical performance while occupying minimal vertical space, making it ideal for slim and compact electronic designs.

Minimum Supply Voltage: 2.2 V

The low minimum supply voltage requirement enables lower power operation and extends battery life, making this microcontroller energy-efficient and suitable for portable devices.

Maximum Operating Temperature: 85 °C

Operating reliably at high temperatures, up to 85°C, makes this microcontroller suitable for demanding industrial applications, ensuring reliable performance even in challenging environments.

CPU Family: CORTEX-M4

Based on the Cortex-M4 CPU architecture, this microcontroller offers advanced features such as DSP instructions and digital signal processing capabilities, making it suitable for applications requiring high-performance processing.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate at extremely low temperatures, down to -40°C, ensures reliable functionality in cold environments or outdoor applications.

Terminal Finish: TIN SILVER COPPER

The use of a tin-silver-copper terminal finish offers excellent solderability and corrosion resistance, ensuring reliable connections and longevity in various operating conditions.

ADC Channels: YES

The availability of ADC channels enables precise analog-to-digital conversion, allowing the microcontroller to interface with analog sensors or capture analog signals accurately, expanding its usefulness across diverse applications.

DMA Channels: YES

With DMA channels, this microcontroller can offload data transfer tasks from the CPU, enhancing overall system performance and enabling efficient data handling in complex applications.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and enables easy thermal management, making this microcontroller convenient for designs that require efficient heat dissipation.

ROM Words: 524288

With a ROM size of 524,288 words, this microcontroller offers ample space for program storage, allowing for complex firmware and software implementation in a wide range of applications.

Maximum Seated Height: 1.55 mm

The microcontroller's low seated height facilitates compact system designs, ensuring minimal height limitations and enabling seamless integration in space-constrained applications.

Width: 17 mm

The microcontroller's compact width allows for flexible layout options, making it suitable for designs where space optimization is critical.

External Data Bus Width: 32

Supporting a wide 32-bit external data bus width enables efficient data transfer between the microcontroller and external memory or peripherals, enhancing overall system performance.

Maximum Clock Frequency: 25 MHz

The microcontroller's high maximum clock frequency of 25 MHz allows for fast execution of instructions, enabling quick processing and responsiveness in time-sensitive applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand the peak reflow temperature for up to 30 seconds, ensuring secure solder joints during manufacturing processes, making it highly suitable for high-volume production.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller is compatible with industry-standard reflow soldering processes, ensuring easy and reliable manufacturing integration.

Length: 17 mm

The microcontroller's compact length allows for flexible placement options, contributing to efficient space utilization in various electronic designs.

Temperature Grade: INDUSTRIAL

Designed and certified for industrial temperature range operation, this microcontroller can withstand harsh environmental conditions, ensuring reliable performance in demanding applications.

Peripheral IC Type: MICROCONTROLLER, RISC

As a microcontroller with a RISC (Reduced Instruction Set Computer) architecture, this device offers simplified instruction execution and more efficient use of system resources, making it suitable for embedded systems with limited processing power.

RAM Bytes: 139264

With a RAM size of 139,264 bytes, this microcontroller can store and access a significant amount of data quickly, enabling efficient execution of complex algorithms and multitasking capabilities.

Technology: CMOS

Based on CMOS technology, this microcontroller provides low power consumption, high noise immunity, and compatibility with a wide range of voltages, enhancing its versatility and energy efficiency.

Terminal Form: BALL

The ball terminal form simplifies the soldering process, providing a reliable electrical connection while facilitating automated assembly, making it suitable for high-volume manufacturing.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this microcontroller operates at a commonly used voltage level, ensuring compatibility with numerous electronic systems and power sources.

PWM Channels: YES

Offering PWM (Pulse-Width Modulation) channels, this microcontroller allows for precise control of analog outputs, making it an ideal choice for applications requiring accurate and dynamic control of motors, LEDs, or audio signals.

ROM Programmability: FLASH

The microcontroller's ROM programmability using flash memory technology enables easy firmware updates, simplifies development, and ensures flexibility for future enhancements or bug fixes.

Terminal Pitch: 1 mm

With a terminal pitch of 1 mm, this microcontroller provides ample space for soldering and routing signals, allowing for reliable connections and ease of assembly.

Moisture Sensitivity Level (MSL): 3

Having an MSL rating of 3 indicates that this microcontroller can withstand moderate exposure to moisture during manufacturing and handling processes, ensuring long-term reliability in various environments.

Speed: 204 rpm

Capable of operating at a speed of 204 revolutions per minute, this microcontroller is suitable for motor control applications or precision rotational control, ensuring accurate and efficient speed control.

No. of I/O Lines: 164

With 164 I/O lines, this microcontroller offers extensive input/output capabilities, allowing for seamless integration with a wide range of external devices, sensors, and peripherals, providing versatility in system design.

Technical Specifications

Microcontrollers LPC4353JET256,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B256

JESD-609 Code:

e1

Length:

17 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

164

No. of Terminals:

256

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA256,16X16,40

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5/3.3

Qualification:

Not Qualified

RAM Bytes:

139264

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.55 mm

Speed:

204 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.2 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17 mm

Peripheral IC Type:

Trade Compliance

LPC4353JET256,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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