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LPC3250FET296-S

NXP Semiconductors

LPC3250FET296-S by NXP Semiconductors

NXP Semiconductors' LPC3250FET296-S is a 32-bit microcontroller with 262144 RAM Bytes and 16384 ROM Words. It operates at speeds up to 266 rpm, suitable for industrial applications requiring high processing power in a compact GRID ARRAY package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Digiode

USA . 676 parts In-Stock

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Anansix

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Vyrian

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Nova Conductors

Japan . 36 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,448 parts In-Stock

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$16.350

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AZTECH Wire

Italy . 761 parts In-Stock

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Semicontronic

India . 223 parts In-Stock

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$20.000

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$19.500

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$19.400

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Ampacity Inc.

Singapore . 206 parts In-Stock

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One Stop Electronics

USA . 254 parts In-Stock

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$32.000

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Corohmni

South Africa . 260 parts In-Stock

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$67.752

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Continental Prestige Electronics

USA . 6,517 parts In-Stock

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Argo Parts USA

USA . 2,747 parts In-Stock

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UNI Independent Distributors

Spain . 908 parts In-Stock

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Corphita

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Bastille Electronics

Australia . 300 parts In-Stock

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Overview

Unleash the power of innovation with the LPC3250FET296-S by NXP Semiconductors. Crafted with precision and expertise, this microcontroller offers unrivaled performance and reliability for a wide range of applications. Whether you're designing cutting-edge IoT devices or revolutionizing industrial automation, this product delivers exceptional value and efficiency. Trust in NXP Semiconductors to provide unparalleled quality and unleash the full potential of your next project with the LPC3250FET296-S. Elevate your designs and exceed expectations with this game-changing microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the microcontroller, making it suitable for various industrial applications.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration onto circuit boards, saving space and simplifying the manufacturing process.

Bit Size: 32

The 32-bit architecture enables the microcontroller to handle complex calculations and processes, making it ideal for applications requiring high computational power.

Power Supplies (V): 1.3, 3.3

The availability of multiple power supply options gives flexibility in designing and powering the microcontroller, catering to different voltage requirements of various applications.

No. of Terminals: 296

The large number of terminals allows for connectivity to multiple external components and peripherals, enhancing the versatility and expandability of the microcontroller.

Package Style (Meter): GRID ARRAY, FINE PITCH

The grid array and fine pitch package style facilitates high-density mounting and interconnection, enabling compact design and efficient signal routing on the PCB.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range ensures reliable performance in harsh environmental conditions, making it suitable for industrial automation and automotive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for operation in cold environments without compromising the performance and functionality of the microcontroller.

ROM Words: 16384

The 16384 ROM words provide ample storage for firmware and program code, allowing for the implementation of complex algorithms and applications on the microcontroller.

RAM Bytes: 262144

The large RAM capacity of 262144 bytes enables efficient data processing and storage, facilitating multitasking and memory-intensive applications on the microcontroller.

Speed: 266 rpm

The operating speed of 266 rpm ensures rapid execution of instructions and tasks, meeting the performance requirements of real-time control systems and high-speed applications.

Technical Specifications

Microcontrollers LPC3250FET296-S attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Bit Size:

32

JESD-30 Code:

S-PBGA-B296

No. of Terminals:

296

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA296,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Power Supplies (V):

1.3,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Words:

16384

ROM Programmability:

MROM

Speed:

266 rpm

Sub-Category:

Microcontrollers

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Trade Compliance

LPC3250FET296-S Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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