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LPC3250FET296/01K

NXP Semiconductors

LPC3250FET296/01K by NXP Semiconductors

NXP Semiconductors' LPC3250FET296/01K microcontroller features ARM926EJ-S CPU, 32-bit data bus, and 18 external interrupts. Ideal for applications requiring low power mode, it offers 262144 bytes of RAM, 3-channel ADC, and connectivity options like Ethernet and UART(7). With a max clock frequency of 20 MHz, this microcontroller is suitable for various embedded systems.

Median Price

$13.682

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 478 parts In-Stock

1+ parts

$12.220

100+ parts

$9.600

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478

$12.220

$9.600

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Chip1Stop

Japan . 588 parts In-Stock

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$13.600

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$13.600

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Arrow

USA . 530 parts In-Stock

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$13.682

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530

$13.682

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Verical

USA . 530 parts In-Stock

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$13.682

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530

$13.682

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Newark

USA . 422 parts In-Stock

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$19.300

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$13.550

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$12.770

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422

$19.300

$13.550

$12.770

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DigiKey

USA . 722 parts In-Stock

1+ parts

$20.860

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$15.590

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$13.545

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722

$20.860

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$13.545

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Mouser Electronics

USA . 1,621 parts In-Stock

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$22.600

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$15.420

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$14.280

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$22.600

$15.420

$14.280

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Element14

Singapore . 478 parts In-Stock

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$23.400

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$18.390

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478

$23.400

$18.390

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Future Electronics

Canada . 20,014 parts In-Stock

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$11.130

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$11.130

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Rochester

USA . 2,780 parts In-Stock

1+ parts

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$10.650

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$9.530

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$8.970

2,780

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$10.650

$9.530

$8.970

Avnet

USA . 378 parts In-Stock

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Digiode

USA . 4,698 parts In-Stock

1+ parts

$9.614

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4,698

$9.614

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Nova Conductors

Japan . 10 parts In-Stock

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$15.870

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10

$15.870

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Maritex

Poland . 630 parts In-Stock

1+ parts

$22.383

100+ parts

$14.286

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630

$22.383

$14.286

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IBS Electronics

USA . 20,014 parts In-Stock

1+ parts

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$15.610

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$16.115

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$15.610

$16.115

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NAC Semi

USA . 3,780 parts In-Stock

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$17.720

10k+ parts

$16.350

3,780

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$17.720

$16.350

Chip Stock

USA . 2,850 parts In-Stock

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2,850

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Anansix

USA . 2,511 parts In-Stock

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2,511

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Vyrian

USA . 1,155 parts In-Stock

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Sensible Micro Corp

USA . 75 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 1,462 parts In-Stock

1+ parts

$8.600

100+ parts

$8.385

1k+ parts

$8.342

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1,462

$8.600

$8.385

$8.342

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Ampacity Inc.

Singapore . 1,242 parts In-Stock

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$8.600

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$8.600

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Corphita

USA . 4,790 parts In-Stock

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$9.108

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Advanced Electronics

New Zealand . 32 parts In-Stock

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$16.187

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$16.187

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$16.187

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$16.187

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$16.187

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Vigor

Singapore . 1,666 parts In-Stock

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$16.840

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Continental Prestige Electronics

USA . 21 parts In-Stock

1+ parts

$18.750

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$12.660

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$18.750

$12.660

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Aztec Data Supply Inc.

USA . 521 parts In-Stock

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$46.180

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Microchip USA

USA . 1,293 parts In-Stock

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$49.680

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Corohmni

South Africa . 1,158 parts In-Stock

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$71.696

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$71.696

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Modulus Dynamics

Lithuania . 3,816 parts In-Stock

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$80.059

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$80.059

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$80.059

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Lixinc

USA . 17,113 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 6,354 parts In-Stock

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Argo Parts USA

USA . 1,259 parts In-Stock

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GreenTree Electronics

Israel . 630 parts In-Stock

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630

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Robosynatics

Brazil . 417 parts In-Stock

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417

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Lucentia Tech

USA . 417 parts In-Stock

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$28.086

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$27.513

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$27.513

417

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$27.513

$27.513

UNI Independent Distributors

Spain . 132 parts In-Stock

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132

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Overview

Elevate your electronic designs with the LPC3250FET296/01K by NXP Semiconductors, a top-tier manufacturer renowned for cutting-edge microcontrollers. This high-quality product boasts integrated cache and a wide range of peripherals, making it perfect for a variety of applications. With low power mode and maximum clock frequency of 20 MHz, this microcontroller offers exceptional value and benefits to customers looking to optimize their projects. Revolutionize your creations with the LPC3250FET296/01K and experience unparalleled performance and efficiency like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is cost-effective and durable, making the product budget-friendly and long-lasting.

Integrated Cache: YES

The integrated cache improves the overall performance and speed of the microcontroller.

Surface Mount: YES

This feature allows for easy installation and saves space on the PCB, making it efficient for compact designs.

Maximum Supply Voltage: 1.39 V

With a higher supply voltage, the microcontroller can handle more power without risking damage.

On Chip Data RAM Width: 8

The wider data RAM width allows for faster data processing and storage capabilities.

Address Bus Width: 24

A larger address bus width enables the microcontroller to access a greater range of memory locations.

Package Shape: SQUARE

The square shape simplifies placement and aligning during assembly, ensuring a straightforward installation process.

Bit Size: 32

The 32-bit architecture provides better performance and efficiency compared to lower bit sizes.

No. of Terminals: 296

The abundance of terminals allows for versatile connectivity options and functionality.

Package Style: GRID ARRAY, THIN PROFILE, FINE PITCH

This package style offers a compact design with high terminal density, perfect for space-constrained applications.

Minimum Supply Voltage: 1.31 V

The lower minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature: 85 °C

The high operating temperature range ensures stability and reliability in various environmental conditions.

CPU Family: ARM926EJ-S

The use of this CPU family provides a powerful and efficient processing capability for the microcontroller.

No. of External Interrupts: 18

The numerous external interrupts allow for efficient handling of external events, enhancing the functionality of the microcontroller.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures that the microcontroller can operate in extreme cold environments.

ADC Channels: YES

The built-in ADC channels enable the microcontroller to convert analog signals into digital data for processing.

DMA Channels: YES

DMA channels enhance data transfer speed and efficiency, optimizing the microcontroller's performance.

Terminal Position: BOTTOM

The terminal position simplifies the PCB layout and connection process, making it user-friendly.

ROM Words: 16384

The large ROM capacity allows for ample storage space for program instructions and data.

Maximum Seated Height: 1.2 mm

The low profile design makes the microcontroller suitable for compact and slim devices.

Width: 15 mm

The moderate width offers a balance between space-saving and ease of handling during installation.

Boundary Scan: YES

The boundary scan feature helps in testing and diagnosing PCB connections, ensuring reliability and ease of maintenance.

External Data Bus Width: 32

The wide external data bus width allows for efficient data transfer between the microcontroller and external devices.

Peripherals: DMA(8), LCD, RTC, TIMER(6), WDT

The variety of peripherals enhance the microcontroller's functionality and versatility for different applications.

Maximum Clock Frequency: 20 MHz

The high clock frequency enables fast processing speed and responsiveness of the microcontroller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures proper soldering and reliability during assembly.

Length: 15 mm

The moderate length offers a balance between space-saving and ease of handling during installation.

Peripheral IC Type: MICROCONTROLLER, RISC

This type of peripheral IC provides a reliable and efficient microcontroller platform for various applications.

No. of Timers: 6

The multiple timers enable accurate timing and scheduling functions, essential for many applications.

RAM Bytes: 262144

The large RAM capacity allows for efficient data processing and storage capabilities.

Technology: CMOS

The use of CMOS technology ensures low power consumption and high speed performance.

Terminal Form: BALL

The ball terminal form provides a secure and reliable connection, essential for stable operation.

Analog To Digital Convertors: 3-Ch 10-Bit

The integrated ADCs offer precise analog to digital conversion, essential for sensor interfacing and data acquisition.

Maximum Supply Current: 100 mA

The maximum supply current indicates the power consumption capacity of the microcontroller.

Nominal Supply Voltage: 1.35 V

The nominal supply voltage provides a stable operating voltage for the microcontroller.

No. of Serial I/Os: 10

The multiple serial I/Os enable communication with external devices, expanding the connectivity options.

PWM Channels: YES

The PWM channels allow for precise control of analog signals, essential for motor control and power management.

Connectivity: ETHERNET, I2C(2), I2S(2), SPI(2), SSP(2), UART(7)

The various connectivity options offer flexibility in communication protocols, suitable for diverse applications.

ROM Programmability: FLASH

The Flash ROM programmability provides flexibility in updating and reprogramming the microcontroller's firmware.

Terminal Pitch: 0.8 mm

The small terminal pitch enables high-density mounting on the PCB, saving space and reducing PCB size.

Format: FLOATING-POINT

The floating-point format allows for accurate and efficient mathematical calculations, essential for many applications.

Moisture Sensitivity Level (MSL): 3

The MSL rating ensures proper handling and storage of the microcontroller to prevent moisture-related damage.

Speed: 266 rpm

The high speed processing capability enables quick response and efficient execution of tasks.

Low Power Mode: YES

The low power mode helps in conserving energy and extending battery life, ideal for portable and battery-operated devices.

On Chip Program ROM Width: 8

The program ROM width of 8 bits allows for efficient storage and execution of program instructions.

No. of I/O Lines: 51

The abundant I/O lines enable versatile connectivity options and expand the functionality of the microcontroller.

Technical Specifications

Microcontrollers LPC3250FET296/01K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO OPERATED AT 0.9V AT 14 MHZ

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM926EJ-S

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B296

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

8

No. of External Interrupts:

18

No. of I/O Lines:

51

No. of Serial I/Os:

10

No. of Terminals:

296

No. of Timers:

6

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA296,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

262144

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

266 rpm

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

1.39 V

Minimum Supply Voltage:

1.31 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

ETHERNET, I2C(2), I2S(2), SPI(2), SSP(2), UART(7)

Peripherals:

DMA(8), LCD, RTC, TIMER(6), WDT

Analog To Digital Convertors:

3-Ch 10-Bit

Trade Compliance

LPC3250FET296/01K Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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