Loading...

LPC3152FET208,551

NXP Semiconductors

LPC3152FET208,551 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 208; Package Code: TFBGA; Package Shape: SQUARE;

Median Price

$7.200

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 10,679 parts In-Stock

1+ parts

$8.180

100+ parts

$6.920

1k+ parts

$5.390

10k+ parts

$4.620

10,679

$8.180

$6.920

$5.390

$4.620

Rochester

USA . 10,679 parts In-Stock

1+ parts

-

100+ parts

$7.200

1k+ parts

$6.440

10k+ parts

$6.060

10,679

-

$7.200

$6.440

$6.060

DigiKey

USA . 10,679 parts In-Stock

1+ parts

-

100+ parts

$4.640

1k+ parts

-

10k+ parts

-

10,679

-

$4.640

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,974 parts In-Stock

1+ parts

$4.640

100+ parts

-

1k+ parts

-

10k+ parts

-

3,974

$4.640

-

-

-

Digiode

USA . 3,177 parts In-Stock

1+ parts

$7.610

100+ parts

-

1k+ parts

-

10k+ parts

-

3,177

$7.610

-

-

-

Anansix

USA . 93 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

93

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Component Stockers USA

USA . 19,769 parts In-Stock

1+ parts

$4.570

100+ parts

$4.300

1k+ parts

$3.880

10k+ parts

$3.880

19,769

$4.570

$4.300

$3.880

$3.880

Corphita

USA . 1,115 parts In-Stock

1+ parts

$7.209

100+ parts

-

1k+ parts

-

10k+ parts

-

1,115

$7.209

-

-

-

Vigor

Singapore . 10,493 parts In-Stock

1+ parts

$7.950

100+ parts

-

1k+ parts

-

10k+ parts

-

10,493

$7.950

-

-

-

Continental Prestige Electronics

USA . 10,679 parts In-Stock

1+ parts

$8.180

100+ parts

$6.920

1k+ parts

$5.390

10k+ parts

-

10,679

$8.180

$6.920

$5.390

-

Microchip USA

USA . 358 parts In-Stock

1+ parts

$20.302

100+ parts

-

1k+ parts

-

10k+ parts

-

358

$20.302

-

-

-

Advanced Electronics

New Zealand . 15 parts In-Stock

1+ parts

$32.944

100+ parts

$29.979

1k+ parts

$27.014

10k+ parts

-

15

$32.944

$29.979

$27.014

-

QUARKTWIN TECHNOLOGY LTD

USA . 7,695 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,695

-

-

-

-

UNI Independent Distributors

Spain . 5,493 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,493

-

-

-

-

Technical Specifications

Microcontrollers LPC3152FET208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM9

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PBGA-B208

JESD-609 Code:

e1

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

208

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA208,17X17,25

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,1.8/3.3

Qualification:

Not Qualified

RAM Bytes:

196608

ROM Programmability:

FLASH

Maximum Seated Height:

1.15 mm

Speed:

180 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.1 V

Nominal Supply Voltage:

1.2 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

12 mm

Peripheral IC Type:

Trade Compliance

LPC3152FET208,551 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19