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LPC3154FET208

NXP Semiconductors

LPC3154FET208 by NXP Semiconductors

MICROCONTROLLER, RISC; Technology: CMOS; Moisture Sensitivity Level (MSL): 3;

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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10,000

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Digiode

USA . 3,856 parts In-Stock

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3,856

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Vyrian

USA . 2,036 parts In-Stock

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2,036

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Anansix

USA . 2,001 parts In-Stock

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2,001

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Distributors (Availability)

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One Stop Electronics

USA . 1,086 parts In-Stock

1+ parts

$26.000

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1,086

$26.000

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A-Z Elektronik GmbH

Germany . 4,823 parts In-Stock

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4,823

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Alle Elektronik GmbH

Germany . 3,215 parts In-Stock

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3,215

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UNI Independent Distributors

Spain . 690 parts In-Stock

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690

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Corphita

USA . 424 parts In-Stock

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424

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Perfect Parts

USA . 392 parts In-Stock

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392

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Kepictronics

USA . 335 parts In-Stock

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335

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Technical Specifications

Microcontrollers LPC3154FET208 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

Moisture Sensitivity Level (MSL):

3

Technology:

CMOS

Peripheral IC Type:

Trade Compliance

LPC3154FET208 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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