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LPC3250FET296/01,5

NXP Semiconductors

LPC3250FET296/01,5 by NXP Semiconductors

LPC3250FET296/01,5 by NXP Semiconductors is a 32-bit microcontroller with a max clock frequency of 20 MHz. It has 262144 bytes of RAM and can operate in industrial temperature grades. This microcontroller is suitable for applications requiring high-speed processing and extensive memory capabilities.

Median Price

$16.549

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12

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Flip Electronics (Authorized)

USA . 218 parts In-Stock

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Verical

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DigiKey

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$15.360

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Nova Conductors

Japan . 67 parts In-Stock

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Vyrian

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Anansix

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Digiode

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Semtec, LLC

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Avant Electronics Limited

UK . 75 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

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Continental Prestige Electronics

USA . 657 parts In-Stock

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$9.448

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$9.259

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Modulus Dynamics

Lithuania . 100 parts In-Stock

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$9.853

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$9.755

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$9.459

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AZTECH Wire

Italy . 753 parts In-Stock

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Aztec Data Supply Inc.

USA . 4,841 parts In-Stock

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$16.270

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Ampacity Inc.

Singapore . 218 parts In-Stock

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Microchip USA

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Semicontronic

India . 218 parts In-Stock

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$30.225

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$30.070

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$55.916

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Corohmni

South Africa . 172 parts In-Stock

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Perfect Parts

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S.R.D Solutions

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Futuretech Components

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iodParts Technologies Inc.

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Overview

Experience the power of innovation with the LPC3250FET296/01,5 microcontroller by NXP Semiconductors. Boasting exceptional quality and reliability, NXP is a trusted manufacturer in the industry. This cutting-edge microcontroller opens up a world of possibilities with its versatile applications. Whether you're working on IoT devices, consumer electronics, or industrial automation, the LPC3250FET296/01,5 delivers unmatched performance. With its advanced features and flexible design, this microcontroller enables seamless integration, efficient power management, and enhanced functionality. Stay ahead of the competition and unlock the true potential of your projects with the LPC3250FET296/01,5 by NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This microcontroller has a durable plastic/epoxy package body material, ensuring the stability and durability of the product.

Surface Mount: YES

With surface mount capabilities, this microcontroller can be easily integrated onto printed circuit boards, allowing for seamless integration into a variety of applications.

Maximum Supply Voltage: 1.39 V

This microcontroller operates at a maximum supply voltage of 1.39 V, which enables efficient power consumption and extends battery life in portable applications.

Address Bus Width: 24

The generous 24-bit address bus width allows for high memory capacity and efficient access to data, making it suitable for complex computational tasks.

Package Shape: SQUARE

The square package shape of this microcontroller provides easy handling and facilitates uniform placement during production, ensuring efficient manufacturing processes.

Bit Size: 32

With a 32-bit architecture, this microcontroller offers enhanced processing power, enabling it to handle complex computations and data processing tasks efficiently.

Power Supplies (V): 1.2,3.3

This microcontroller operates within a power supply range of 1.2 V to 3.3 V, making it versatile and compatible with a wide range of power sources.

No. of Terminals: 296

With a generous number of 296 terminals, this microcontroller provides ample connectivity options, allowing for versatile and flexible integration into various systems.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

The microcontroller's grid array, thin profile, and fine pitch package style promote efficient heat dissipation, allowing for optimal performance even in compact designs.

Minimum Supply Voltage: 1.31 V

The minimum supply voltage of 1.31 V ensures reliable operation even under low power conditions, making it ideal for energy-efficient applications.

Maximum Operating Temperature: 85 °C

This microcontroller can withstand operating temperatures up to 85°C, ensuring reliable performance in demanding environments.

CPU Family: ARM9

With its ARM9 CPU family, this microcontroller offers powerful processing capabilities, making it suitable for applications that require high-performance computing.

Minimum Operating Temperature: -40 °C

The microcontroller's ability to operate in temperatures as low as -40°C enables its use in extreme environments and ensures reliable functionality.

Terminal Finish: TIN SILVER COPPER

The use of tin silver copper terminal finish provides excellent conductivity, ensuring reliable connections and minimizing signal loss.

ADC Channels: YES

This microcontroller features ADC (Analog-to-Digital Converter) channels, allowing for the conversion of analog signals into digital data, making it suitable for sensor applications.

DMA Channels: YES

With integrated DMA (Direct Memory Access) channels, this microcontroller can efficiently transfer data between peripherals and memory, improving overall system performance.

Terminal Position: BOTTOM

The microcontroller's bottom terminal position facilitates easy and convenient soldering during the production process, ensuring reliable and robust connections.

Maximum Seated Height: 1.2 mm

With a maximum seated height of 1.2 mm, this microcontroller is suitable for slim and compact designs, making it ideal for space-constrained applications.

Width: 15 mm

The microcontroller's width of 15 mm allows for easy integration into various PCB layouts, enabling flexibility in design and assembly.

External Data Bus Width: 32

The 32-bit external data bus width ensures efficient data transfer between the microcontroller and external memory, enabling high-speed processing and responsiveness.

Maximum Clock Frequency: 20 MHz

With a maximum clock frequency of 20 MHz, this microcontroller can execute instructions and handle data at a rapid pace, delivering high performance in real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

The microcontroller can withstand a maximum time of 30 seconds at peak reflow temperatures, ensuring proper soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this microcontroller can withstand high-temperature soldering processes, ensuring reliable connections and long-term durability.

Length: 15 mm

The microcontroller's length of 15 mm allows for easy integration into various PCB layouts, enabling flexibility in design and assembly.

Temperature Grade: INDUSTRIAL

With an industrial grade temperature rating, this microcontroller can reliably operate in harsh industrial environments, making it suitable for industrial automation and control applications.

Peripheral IC Type: MICROCONTROLLER, RISC

This microcontroller belongs to the RISC (Reduced Instruction Set Computer) architecture family, offering simplified instruction execution for enhanced efficiency and performance.

RAM Bytes: 262144

With a generous RAM capacity of 262,144 bytes, this microcontroller can handle extensive data storage and manipulation, supporting complex algorithms and applications.

Technology: CMOS

The use of CMOS (Complementary Metal-Oxide-Semiconductor) technology in this microcontroller enables low power consumption, high noise immunity, and improved performance.

Terminal Form: BALL

The microcontroller's ball terminal form allows for reliable electrical connections and promotes efficient heat dissipation, contributing to the longevity and stability of the product.

Nominal Supply Voltage: 1.35 V

With a nominal supply voltage of 1.35 V, this microcontroller operates within an optimal voltage range, ensuring stable and efficient performance.

PWM Channels: YES

This microcontroller features PWM (Pulse Width Modulation) channels, allowing for precise control of analog outputs, making it suitable for applications like motor control and audio synthesis.

ROM Programmability: FLASH

The microcontroller's ROM programmability using flash memory allows for flexible firmware updates and customization, facilitating adaptability to changing requirements and future enhancements.

Terminal Pitch: 0.8 mm

With a terminal pitch of 0.8 mm, this microcontroller allows for close spacing in PCB layouts, enabling compact designs and efficient use of available space.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level 3 ensures proper handling and storage to prevent moisture-related issues, improving the reliability and longevity of the microcontroller.

Speed: 266 rpm

With a speed rating of 266 revolutions per minute (rpm), this microcontroller delivers fast and efficient processing capabilities, meeting the demands of time-sensitive applications.

No. of I/O Lines: 87

The microcontroller features 87 input/output (I/O) lines, providing extensive connectivity options and enabling interaction with various external devices and peripherals.

Technical Specifications

Microcontrollers LPC3250FET296/01,5 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

CPU Family:

ARM9

Maximum Clock Frequency:

20 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B296

JESD-609 Code:

e1

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

87

No. of Terminals:

296

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA296,18X18,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.2,3.3

Qualification:

Not Qualified

RAM Bytes:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

266 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.39 V

Minimum Supply Voltage:

1.31 V

Nominal Supply Voltage:

1.35 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Trade Compliance

LPC3250FET296/01,5 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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